Method for forming conductive electrode patterns and method for manufacturing solar cells comprising the same
    3.
    发明授权
    Method for forming conductive electrode patterns and method for manufacturing solar cells comprising the same 有权
    用于形成导电电极图案的方法及其制造方法

    公开(公告)号:US09412524B2

    公开(公告)日:2016-08-09

    申请号:US14476010

    申请日:2014-09-03

    发明人: Kyoung Jin Jeong

    IPC分类号: H01L21/00 H01G9/20

    摘要: A method for forming conductive electrode patterns of a solar cell is provided. The method includes preparing a glass substrate and forming a transparent conductive oxide film (TCO) on the glass substrate. Then, a titanium oxide (TiO2) layer and a silver (Ag) electrode are formed on the glass substrate. A nickel (Ni) layer is formed on the Ag electrode and a copper (Cu) layer is formed on the Ni layer. In addition, a tin (Sn) layer is formed on the Cu layer.

    摘要翻译: 提供一种用于形成太阳能电池的导电电极图案的方法。 该方法包括制备玻璃基板并在玻璃基板上形成透明导电氧化膜(TCO)。 然后,在玻璃基板上形成氧化钛(TiO 2)层和银(Ag)电极。 在Ag电极上形成镍(Ni)层,在Ni层上形成铜(Cu)层。 此外,在Cu层上形成锡(Sn)层。

    METHOD FOR FORMING CONDUCTIVE ELECTRODE PATTERNS AND METHOD FOR MANUFACTURING SOLAR CELLS COMPRISING THE SAME
    6.
    发明申请
    METHOD FOR FORMING CONDUCTIVE ELECTRODE PATTERNS AND METHOD FOR MANUFACTURING SOLAR CELLS COMPRISING THE SAME 有权
    形成导电电极图案的方法及其制造包含其的太阳能电池的方法

    公开(公告)号:US20150140727A1

    公开(公告)日:2015-05-21

    申请号:US14476010

    申请日:2014-09-03

    发明人: Kyoung Jin Jeong

    IPC分类号: H01G9/20

    摘要: A method for forming conductive electrode patterns of a solar cell is provided. The method includes preparing a glass substrate and forming a transparent conductive oxide film (TCO) on the glass substrate. Then, a titanium oxide (TiO2) layer and a silver (Ag) electrode are formed on the glass substrate. A nickel (Ni) layer is formed on the Ag electrode and a copper (Cu) layer is formed on the Ni layer. In addition, a tin (Sn) layer is formed on the Cu layer.

    摘要翻译: 提供一种用于形成太阳能电池的导电电极图案的方法。 该方法包括制备玻璃基板并在玻璃基板上形成透明导电氧化膜(TCO)。 然后,在玻璃基板上形成氧化钛(TiO 2)层和银(Ag)电极。 在Ag电极上形成镍(Ni)层,在Ni层上形成铜(Cu)层。 此外,在Cu层上形成锡(Sn)层。