公开(公告)号：US20200335270A1

公开(公告)日：2020-10-22

申请号：US16850078

申请日：2020-04-16

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro Nishiwaki ,  Kazuhiko Kuranobu ,  Hiroaki Uno

IPC: H01F27/40 ,  H01F27/24 ,  H01F27/28 ,  H05K1/16 ,  H05K1/11 ,  H01F41/04

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film, first through-hole lands formed on the core substrate such that each of the first through-hole lands includes a lowermost layer including a metal foil and that the first through-hole lands are connected to the first through-hole conductors respectively, and second through-hole lands formed on the magnetic resin such that each of the second through-hole lands includes a lowermost layer including a plating film and that the second through-hole lands are connected to the second through-hole conductors respectively.

公开(公告)号：US20200335257A1

公开(公告)日：2020-10-22

申请号：US16847748

申请日：2020-04-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro NISHIWAKI ,  Kazuhiko KURANOBU ,  Hiroaki UNO

IPC: H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H05K1/16

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings of the core substrate, and through-hole conductors formed through the core substrate such that each of the through-hole conductors includes a metal film. The magnetic resin has through holes formed through the magnetic resin such that the through-hole conductors include a group of through-hole conductors formed in the through holes formed through the magnetic resin, and the magnetic resin includes an iron oxide filler in an amount of 60% by weight or more.

公开(公告)号：US20220181064A1

公开(公告)日：2022-06-09

申请号：US17676558

申请日：2022-02-21

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Atsushi ISHIDA ,  Kazuro NISHIWAKI

IPC: H01F27/24

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.

公开(公告)号：US20200335259A1

公开(公告)日：2020-10-22

申请号：US16855108

申请日：2020-04-22

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro NISHIWAKI ,  Kazuhiko KURANOBU ,  Hiroaki UNO

IPC: H01F27/28 ,  H01L23/498 ,  H01L23/552 ,  H01F41/04 ,  H01L21/48

Abstract: An inductor built-in substrate includes a core substrate having openings, a magnetic resin filled in the openings and having through holes, and through-hole conductors formed in the through holes respectively such that each of the through-hole conductors includes a metal film. The magnetic resin is formed such that each of the through holes has an angle part having an obtuse angle formed by an upper surface of the magnetic resin and a side wall of a respective one of the through holes.

公开(公告)号：US20200335258A1

公开(公告)日：2020-10-22

申请号：US16850109

申请日：2020-04-16

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Kazuro Nishiwaki ,  Kazuhiko Kuranobu ,  Hiroaki Uno

IPC: H01F27/28 ,  H01L23/538 ,  H01L49/02 ,  H01L23/64 ,  H05K1/02

Abstract: An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.