公开(公告)号：US20240237204A1

公开(公告)日：2024-07-11

申请号：US18408629

申请日：2024-01-10

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke SHIMIZU ,  Fumio NISHIWAKI ,  Ryoya KIMURA

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  H05K2201/0209 ,  H05K2201/0242

Abstract: A wiring substrate includes a first wiring part including a first insulating layer and a first conductor layer laminated on the first insulating layer, and a second wiring part including a second insulating layer and a second conductor layer laminated on the second insulating layer. The thickness of the second insulating layer is smaller than that of the first insulating layer. The thickness of the second conductor layer is smaller than that of the first conductor layer. The first conductor layer includes first wirings including differential wirings having the minimum wiring width of larger than 5 μm and minimum inter-wiring distance of larger than 7 μm. The second conductor layer includes second wirings having the maximum wiring width of 5 μm or less and the maximum inter-wiring distance of 7 μm or less. The second part is positioned closer to the outermost surface of the substrate than the first part.

公开(公告)号：US20240237203A1

公开(公告)日：2024-07-11

申请号：US18408617

申请日：2024-01-10

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke SHIMIZU ,  Fumio NISHIWAKI ,  Ryoya KIMURA

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L21/4857 ,  H01L23/5386 ,  H05K3/4644 ,  H05K1/036 ,  H05K2201/0266

Abstract: A wiring substrate includes a first wiring part including a first insulating layer and a first conductor layer laminated on the first insulating layer, and a second wiring part formed on the first part and including a second insulating layer and a second conductor layer laminated on the second insulating layer. The thickness of the second insulating layer is smaller than that of the first insulating layer. The thickness of the second conductor layer is smaller than that of the first conductor layer. The first conductor layer has a surface on the opposite side with respect to the first insulating layer such that the arithmetic mean roughness of the surface is smaller than that of a surface of the second conductor layer on the opposite side with respect to the second insulating layer. The second part is positioned closer to the outermost surface of the substrate than the first part.