公开(公告)号：US20230113278A1

公开(公告)日：2023-04-13

申请号：US17936924

申请日：2022-09-30

申请人： IBIDEN CO., LTD.

发明人： Takema Adachi ,  Yuji Ikawa

IPC分类号： H05K3/00 ,  H05K3/10 ,  H05K3/26 ,  H05K1/03

摘要： A method for manufacturing a wiring substrate includes forming a second resin insulating layer on a first resin insulating layer such that the second resin insulating layer is in contact with a surface of the first resin insulating layer, irradiating laser upon the second resin insulating layer such that a recess penetrating through the second resin insulating layer and exposing the first resin insulating layer is formed, and forming a conductor layer including conductor material filled in the recess formed through the second resin insulating layer such that the conductor layer is embedded in the second resin insulating layer. The second resin insulating layer are formed on the surface of the first resin insulating layer such that the first resin insulating layer and the second resin insulating layer have different processability with respect to the laser.

公开(公告)号：US11917756B2

公开(公告)日：2024-02-27

申请号：US17485672

申请日：2021-09-27

申请人： IBIDEN CO., LTD.

发明人： Yuji Ikawa

IPC分类号： H05K3/00 ,  H05K1/09 ,  H05K3/06 ,  H05K3/46

CPC分类号： H05K1/09 ,  H05K3/0041 ,  H05K3/062 ,  H05K3/4632 ,  H05K3/0079

摘要： A method for manufacturing a printed wiring board includes forming metal posts on a conductor circuit formed on a resin insulating layer, forming the outermost resin layer on the resin insulating layer such that the metal posts is embedded in the outermost resin layer, forming a mask at a dam formation site for a dam structure of the outermost resin layer to surround at least part of a pad group including the metal posts on the outermost resin layer, and reducing a thickness of the outermost resin layer exposed from the mask such that end portions of the metal posts are exposed from the outermost resin layer, that the metal posts form the pad group, and that the outermost resin layer has the dam structure forming part of the outermost resin layer and formed to surround at least part of the pad group including the metal posts.

公开(公告)号：US10321579B2

公开(公告)日：2019-06-11

申请号：US15657510

申请日：2017-07-24

申请人： IBIDEN CO., LTD.

发明人： Yuji Ikawa

IPC分类号： H05K3/34 ,  H05K3/24 ,  H05K3/28 ,  H05K3/46

摘要： A solder resist includes a lower layer including a first resin and particles, and an upper layer including a second resin and formed on the lower layer. The particles are one kind selected from a group of inorganic particles, and the upper layer is formed such that the upper layer does not contain any kind of particles belonging to the group of inorganic particles.