公开(公告)号：US3498452A

公开(公告)日：1970-03-03

申请号：US3498452D

申请日：1968-05-16

申请人： IBM

发明人： ARONSTEIN JESSE ,  GUNTHERT RICHARD JOHN ,  TROLLMANN CONRAD

IPC分类号： B07C5/06

CPC分类号： B07C5/065 ,  Y10S209/905 ,  Y10S209/919

公开(公告)号：US3653572A

公开(公告)日：1972-04-04

申请号：US3653572D

申请日：1969-09-05

申请人： IBM

发明人： DUSHKES SHERMAN Z ,  TROLLMANN CONRAD

IPC分类号： B23K1/012 ,  B23K1/20

CPC分类号： B23K1/012

摘要： Disclosed is a device for preparing solder coated leads for the final soldering operation. Excess solder is stripped from the solder coated leads by immersing these leads into streams of hot, dry gas. This stream of gas melts and flows away excess solder. A thin coating of solder is retained on the leads. The gas is preferably inert and the process takes place in a chamber which is substantially free of oxygen. This retained solder is ultimately used in the final bonding operation of the lead to a circuit board.

摘要翻译： 公开了一种用于制备用于最终焊接操作的焊料涂层引线的装置。 通过将这些引线浸入热干燥气体的流中，从焊接涂层引线剥离过量的焊料。 这股气体熔化并流出多余的焊料。 引线上保留有薄的焊料涂层。 气体优选是惰性的，并且该过程发生在基本上不含氧的室中。 这种保留的焊料最终用于引线到电路板的最终结合操作。

公开(公告)号：US3576969A

公开(公告)日：1971-05-04

申请号：US3576969D

申请日：1969-09-02

申请人： IBM

发明人： SURTY ROHINTON J ,  TROLLMANN CONRAD

IPC分类号： B23K3/047 ,  H01L21/00 ,  H05K3/34 ,  B23K3/02 ,  H05B3/10

CPC分类号： H01L21/67144 ,  B23K3/0471 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49155

摘要： Disclosed is a device for simultaneously soldering numerous integrated circuit chip leads to a circuit board. The device is characterized by having a heating tip made of refractory, electrically insulative, thermally conductive, material. Fused to this tip is a coat of penetrating metallic paste. The paste is disposed on the tip in an electrically continuous path. Heating is accomplished by passing current through this metallic paste path.