公开(公告)号：US3577037A

公开(公告)日：1971-05-04

申请号：US3577037D

申请日：1968-07-05

Applicant: IBM

Inventor： PIETRO AMERICO R DI ,  THUN RUDOLF E

IPC: H01L21/60 ,  H01L23/14 ,  H01L23/48 ,  H01L23/538 ,  H01L19/00

CPC classification number: H01L23/5384 ,  H01L23/147 ,  H01L23/481 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: An electrical connector having first and second metallization conductive patterns disposed on two faces, respectively, of a semiconductor substrate and one or more diffused interconnections within the substrate for connecting the conductive patterns in a predetermined manner. Circuit apparatus having at least two semiconductor substrates, each of which has a plurality of integrated circuits of the monolithic type, and each of which is mounted on a mutually exclusive face of the aforementioned diffused electrical connector.