Method and apparatus for coating a substrate by utilizing the hollow cathode effect with rf sputtering
    2.
    发明授权
    Method and apparatus for coating a substrate by utilizing the hollow cathode effect with rf sputtering 失效
    通过使用RF溅射使用中空阴影效应来涂覆基板的方法和装置

    公开(公告)号:US3627663A

    公开(公告)日:1971-12-14

    申请号:US3627663D

    申请日:1968-03-25

    Applicant: IBM

    CPC classification number: C23C14/35 H01J37/34

    Abstract: A substrate to be coated by RF sputtering is partially or completely surrounded by a target, which has a similarly shaped cathode surrounding and supporting the target. The target and the cathode may be formed of a pair of parallel plates or a hollow member. By controlling the pressure of the gas within the partially evacuated chamber in which at least the target is disposed and/or the spacing of the cathode plates or the size and geometrical configuration of the hollow member, a single common negative glow can be produced by either having the negative glow from the two parallel cathode plates overlap or touch each other or having a single negative glow within the hollow member.

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