Abstract:
A recording head assembly includes a glass-gapped ferrite head bonded into a ceramic slider with a glass. Infrared bonding is employed. The infrared absorption properties of the glass are increased by the addition of cupric oxide.
Abstract:
Multilayer opto-electronic module structures and their method of fabrication. Alternate layers of light conducting material and light isolating material are formed on a substrate and on each other. Isolating bars are formed in a predetermined pattern within the layers of light conducting material to define optical channels or chambers. Suitable illuminating and detecting means may be included within the channels using the isolating materials as electrical conductors so as to perform logic, memory and display functions.
Abstract:
A method of mounting a ferrite head within a slider wherein the head is positioned within a slot on the slider, a mass of glass composition is heated to thereby fill the gap between the head and slider, machining the head while being held between solidified glass and subsequently heating a second mass of glass by infrared radiation to fill in the depression created by the machine operation.
Abstract:
An air bearing slider assembly includes a U-shaped magnetic head and a monolithic glass body which is formed in the glassy state so as to chemically as well as physically bond the head thereto, a nonmagnetic gap in the base of the head being disposed at an air bearing surface of the glass body to facilitate noncontact magnetic recording. The slider assembly is fabricated using a mold having a central cavity which defines the desired configuration of the glass body and which positions the magnetic head at a selected location relative to the glass body to be formed. The mold cavity is filled with a fluid glass composition which solidifies as a monolithic body in bonded relation to the head.
Abstract:
A transparent, protective coating overlies a photoconductive layer and is integral therewith. The coating, which has a resistivity at least equal to the dark resistivity of the photoconductive material, has a thickness in the range of 50A4000A. The coating is deposited on the photoconductive layer by sputtering through utilization of a high frequency alternating voltage whereby the properties of the coating may be controlled. When applying the high frequency alternating voltage, the power is kept low to produce a relatively high compressive stress of the coating. Controlling the power results in controlling the compressive stress of the coating. The temperature of the photoconductive layer may be maintained at a sufficiently low temperature so that the photoconductive layer retains its photoconductive properties.