公开(公告)号：US20220363881A1

公开(公告)日：2022-11-17

申请号：US17763140

申请日：2020-09-24

Applicant: IDEMITSU KOSAN CO.,LTD.

Inventor： Yutaka OBATA ,  Yasunari OKADA ,  Tomoaki TAKEBE

IPC: C08L23/22 ,  C08L33/10 ,  B29C45/53 ,  B29C45/73 ,  B29C45/27

Abstract: A thermosetting composition comprising the following component (A) and component (B), and having a viscosity of 0.1 Pa·s or higher and 100 Pa·s or lower at a shear rate of 10 s−1 at 25° C. measured in accordance with JIS K7117-2. (A) polybutadiene having a structural unit represented by the following formula (1A) and a structural unit represented by the following formula (1B), wherein the terminal group comprises a methacryloyl group or an acryloyl group (B) a thermal polymerization initiator

公开(公告)号：US20240199782A1

公开(公告)日：2024-06-20

申请号：US18285823

申请日：2022-04-06

Applicant: IDEMITSU KOSAN CO.,LTD.

Inventor： Yutaka OBATA ,  Yasunari OKADA ,  Katsuki ITO ,  Kazuki WATANABE

IPC: C08F222/10 ,  B29C45/00 ,  B29C45/02 ,  B29C45/28 ,  B29K35/00 ,  C08K3/22

CPC classification number: C08F222/1061 ,  B29C45/0001 ,  B29C45/02 ,  B29C45/28 ,  C08F222/102 ,  C08K3/22 ,  B29K2035/00 ,  C08K2003/2217 ,  C08K2003/2227 ,  C08K2201/005

Abstract: A thermosetting composition comprising: (A) a di(meth)acrylate compound having a structural unit represented by the formula (A1), (B) a thermal polymerization initiator, and (E) an inorganic filler.

公开(公告)号：US20240208116A1

公开(公告)日：2024-06-27

申请号：US18285817

申请日：2022-04-06

Applicant: IDEMITSU KOSAN CO.,LTD.

Inventor： Yutaka OBATA ,  Yasunari OKADA ,  Katsuki ITO ,  Kazuki WATANABE

IPC: B29C45/00 ,  B29C45/02 ,  B29C45/76 ,  B29K31/00

CPC classification number: B29C45/0001 ,  B29C45/02 ,  B29C45/76 ,  B29C2945/76006 ,  B29C2945/7604 ,  B29K2031/00

Abstract: A thermosetting composition for injection molding comprising: (A) a di(meth)acrylate compound having structural units represented by the formulas (A1), and (B) a thermal polymerization initiator.

公开(公告)号：US20240227256A1

公开(公告)日：2024-07-11

申请号：US18285821

申请日：2022-04-06

Applicant: IDEMITSU KOSAN CO.,LTD.

Inventor： Yutaka OBATA ,  Yasunari OKADA ,  Katsuki ITO ,  Kazuki WATANABE

IPC: B29C45/00 ,  B29C45/02 ,  B29K75/00 ,  B29K85/00

CPC classification number: B29C45/0001 ,  B29C45/02 ,  B29C2945/76006 ,  B29K2075/00 ,  B29K2085/00

Abstract: A thermosetting composition for injection molding comprising: (A) a compound represented by the following formula (A2) or (A3), and (B) a thermal polymerization initiator; wherein the composition further comprises no (G) titanium oxide or comprises (G) titanium oxide, when the composition comprises the component (G), the content of the component (G) is 5 parts by mass or less, based on a total of 100 parts by mass of components other than the component (B) and the component (C); and the composition comprises no polybutadiene di(meth)acrylate:

公开(公告)号：US20240368322A1

公开(公告)日：2024-11-07

申请号：US18285825

申请日：2022-04-06

Applicant: IDEMITSU KOSAN CO.,LTD.

Inventor： Yutaka OBATA ,  Yasunari OKADA ,  Katsuki ITO ,  Kazuki WATANABE

IPC: C08F222/10 ,  B29C45/00 ,  B29C45/58 ,  B29K33/00 ,  B29K305/02 ,  B29L31/34 ,  C08F220/18 ,  C08K3/22 ,  C08K5/14 ,  C08K5/521

Abstract: A thermosetting composition comprising: (A) a compound represented by the formula (A2) or (A3), (B) a thermal polymerization initiator, and (E) an inorganic filler.