公开(公告)号：US20140138075A1

公开(公告)日：2014-05-22

申请号：US13853073

申请日：2013-03-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Chun-Kai Liu ,  Chi-Chuan Wang ,  Kun-Ying Liou

IPC: F28F3/02

CPC classification number: F28F3/02 ,  F28D15/0233 ,  F28D2021/0028 ,  F28F3/12 ,  F28F2250/06 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect.

Abstract translation: 提供了一种适于冷却热源的热交换器，其中形成在热交换器中的旁通通道的宽度大于其它通道的宽度，以减小流体的流动阻力和用于驱动系统的泵送功率。 也就是说，在相同的泵浦功率损耗下，驱动更多的流体以实现更好的散热效果。 通过应用热交换器，电子设备通过支撑衬底结合到热交换器的顶部。 以这种方式，当电子设备通过支撑衬底传送到热交换器时产生的热量经由热交换器散发到外部。 由于传热距离减小，所以由设备之间的界面产生的热阻降低，以提高传热效率和散热效果。