中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

20 records (took 0.022 seconds)

    Waste heat exchanger
    1.
    发明授权
    Waste heat exchanger 有权

    公开(公告)号：US09915184B2

    公开(公告)日：2018-03-13

    申请号：US14571118

    申请日：2014-12-15

    Applicant: Industrial Technology Research Institute

    Inventor： Wei-Kuo Han ,  Chun-Kai Liu

    IPC: F28D21/00 ,  F01N5/02 ,  F28F1/40 ,  F28F1/42 ,  F28D7/10 ,  F28F1/04

    CPC classification number: F01N5/025 ,  F28D7/10 ,  F28D21/0003 ,  F28F1/04 ,  F28F1/40 ,  F28F1/42

    Abstract: A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.

    STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF
    2.
    发明申请
    STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF 审中-公开

    公开(公告)号：US20180040798A1

    公开(公告)日：2018-02-08

    申请号：US15721743

    申请日：2017-09-30

    Applicant: Industrial Technology Research Institute

    Inventor： Li-Ling Liao ,  Ming-Ji Dai ,  Chun-Kai Liu ,  Cheng-Heng Kao ,  Cheng-Chieh Li ,  Jeffrey Snyder ,  Fivos Drymiotis

    IPC: H01L35/32 ,  H01L35/34

    CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

    Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

    WASTE HEAT EXCHANGER
    5.
    发明申请
    WASTE HEAT EXCHANGER 有权
    废热交换器

    公开(公告)号：US20160053653A1

    公开(公告)日：2016-02-25

    申请号：US14571118

    申请日：2014-12-15

    Applicant: Industrial Technology Research Institute

    Inventor： Wei-Kuo Han ,  Chun-Kai Liu

    IPC: F01N5/02 ,  F25B21/04

    CPC classification number: F01N5/025 ,  F28D7/10 ,  F28D21/0003 ,  F28F1/04 ,  F28F1/40 ,  F28F1/42

    Abstract: A waste heat exchanger may include an inner tube, an outer tube, a fin assembly and a plurality of heat electric modules The inner tube has a plurality of holes. Disposed inside the inner tube is a plurality of inlet channels and a plurality of outlet channels. The plurality of inlet channels and the plurality of outlet channels are disposed to correspond to each other. The plurality of inlet channels and the plurality of outlet channels are connected to the plurality of holes. A fluid flows through the plurality of inlets and the plurality of holes to get into the outlet channels. The outer tube is disposed outside the inner tube. The conductive assembly is positioned between the inner tube and the outer tube. The conductive assembly is disposed on an outside surface of the inner tube and an inside surface of the outer tube.

    Abstract translation: 废热交换器可以包括内管，外管，翅片组件和多个热电模块。内管具有多个孔。 设置在内管内部的是多个入口通道和多个出口通道。 多个入口通道和多个出口通道被设置成彼此对应。 多个入口通道和多个出口通道连接到多个孔。 流体流过多个入口和多个孔以进入出口通道。 外管设置在内管的外侧。 导电组件位于内管和外管之间。 导电组件设置在内管的外表面和外管的内表面上。

    POWER MODULE
    6.
    发明公开
    POWER MODULE 审中-公开

    公开(公告)号：US20240162114A1

    公开(公告)日：2024-05-16

    申请号：US18166496

    申请日：2023-02-09

    Applicant: Industrial Technology Research Institute

    Inventor： Shian-Chiau Chiou ,  Chun-Kai Liu ,  Po-Kai Chiu ,  Chih-Ming Tzeng ,  Yao-Shun Chen

    IPC: H01L23/427 ,  H01L23/498

    CPC classification number: H01L23/427 ,  H01L23/49894 ,  H01L24/32

    Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

    Power module
    7.
    发明授权
    Power module 有权

    公开(公告)号：US11362014B2

    公开(公告)日：2022-06-14

    申请号：US16884403

    申请日：2020-05-27

    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

    Inventor： Chun-Kai Liu ,  Yao-Shun Chen ,  Po-Kai Chiu

    IPC: H01L23/373 ,  H01L23/31 ,  H01L23/00 ,  H05K7/20 ,  H01L23/433

    Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.

    HEAT EXCHANGER AND SEMICONDUCTOR MODULE
    9.
    发明申请
    HEAT EXCHANGER AND SEMICONDUCTOR MODULE 审中-公开
    热交换器和半导体模块

    公开(公告)号：US20140138075A1

    公开(公告)日：2014-05-22

    申请号：US13853073

    申请日：2013-03-29

    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

    Inventor： Shu-Jung Yang ,  Yu-Lin Chao ,  Chun-Kai Liu ,  Chi-Chuan Wang ,  Kun-Ying Liou

    IPC: F28F3/02

    CPC classification number: F28F3/02 ,  F28D15/0233 ,  F28D2021/0028 ,  F28F3/12 ,  F28F2250/06 ,  H01L23/3735 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect.

    Abstract translation: 提供了一种适于冷却热源的热交换器，其中形成在热交换器中的旁通通道的宽度大于其它通道的宽度，以减小流体的流动阻力和用于驱动系统的泵送功率。 也就是说，在相同的泵浦功率损耗下，驱动更多的流体以实现更好的散热效果。 通过应用热交换器，电子设备通过支撑衬底结合到热交换器的顶部。 以这种方式，当电子设备通过支撑衬底传送到热交换器时产生的热量经由热交换器散发到外部。 由于传热距离减小，所以由设备之间的界面产生的热阻降低，以提高传热效率和散热效果。

Patent Agency Ranking