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公开(公告)号：US20250105486A1
公开(公告)日：2025-03-27
申请号：US18474239
申请日：2023-09-26
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Shu-Jung Yang , Feng-Hsiang Lo , Yu-Lin Chao
Abstract: An antenna-in-package with a heat dissipation structure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is disposed above the first surface of the circuit board. The chip is disposed between the antenna substrate and the first surface of the circuit board and is electrically connected to the antenna substrate. The plurality of heat dissipation fins protrude from the second surface of the circuit board. The chassis encapsulates the circuit board, the antenna substrate, the chip, and the plurality of heat dissipation fins. The dielectric fluid circulates and flows in the chassis through a cooling circulation device and is in direct contact with the plurality of heat dissipation fins.
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公开(公告)号：US10818574B2
公开(公告)日：2020-10-27
申请号：US16883470
申请日：2020-05-26
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC: H01L23/36 , H01L23/373 , H01L25/065 , H01L23/427 , H01L25/11 , H01L25/07 , H01L23/31 , H01L23/467 , H01L23/367
Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
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公开(公告)号：US20140138075A1
公开(公告)日：2014-05-22
申请号：US13853073
申请日：2013-03-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Chi-Chuan Wang , Kun-Ying Liou
IPC: F28F3/02
CPC classification number: F28F3/02 , F28D15/0233 , F28D2021/0028 , F28F3/12 , F28F2250/06 , H01L23/3735 , H01L23/427 , H01L23/473 , H01L2224/32225 , H01L2224/48091 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: A heat exchanger suitable for cooling a heat source is provided, wherein a bypass channel formed in the heat exchanger has a width greater than a width of other channels to reduce a flow resistance of a fluid and a pumping power for driving a system. That is, under the same pumping power loss, more fluid is driven to achieve a better heat dissipation effect. By applying the heat exchanger, electronic devices are bonded to a top of the heat exchanger through a supporting substrate. In this way, heat generated when the electronic devices are is transferred to the heat exchanger through the supporting substrate and dissipated to the outside via the heat exchanger. Since the distance of heat transfer is decreased, the thermal resistance generated by an interface between the devices is reduced to improve heat transfer efficiency and heat dissipation effect.
Abstract translation: 提供了一种适于冷却热源的热交换器，其中形成在热交换器中的旁通通道的宽度大于其它通道的宽度，以减小流体的流动阻力和用于驱动系统的泵送功率。 也就是说，在相同的泵浦功率损耗下，驱动更多的流体以实现更好的散热效果。 通过应用热交换器，电子设备通过支撑衬底结合到热交换器的顶部。 以这种方式，当电子设备通过支撑衬底传送到热交换器时产生的热量经由热交换器散发到外部。 由于传热距离减小，所以由设备之间的界面产生的热阻降低，以提高传热效率和散热效果。
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公开(公告)号：US11602128B2
公开(公告)日：2023-03-14
申请号：US16885250
申请日：2020-05-27
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chih-Chung Chiu , Heng-Chieh Chien
Abstract: An ear tag module includes a rod member, a spike, a circuit component, and a temperature sensor. The spike is disposed on one side of the rod member, and the circuit component is disposed on another side of the rod member. The temperature sensor is electrically connected to the circuit component. When the spike penetrates an ear, the ear is in contact with a sensing area of the rod member, and the temperature sensor is located in the rod member to detect a temperature of the ear and transmit at least one temperature sensing information to the circuit component.
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公开(公告)号：US20180128468A1
公开(公告)日：2018-05-10
申请号：US15479733
申请日：2017-04-05
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Yu-Lin Chao , Wen-Fu Hsu , Chih-Ming Shen , Chia-Wei Jui , Yao-Shun Chen
CPC classification number: F21V21/35 , F21V19/0045 , F21V21/14 , F21V23/06 , F21Y2115/15 , H01R25/142 , Y02B20/36
Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.
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Patent Agency Ranking
公开(公告)号：US09418921B2
公开(公告)日：2016-08-16
申请号：US14965909
申请日：2015-12-11
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC: H01L23/34 , H01L23/495 , H01L25/18 , H01L25/07 , H01L23/498
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
Abstract translation: 功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。 第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。 两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口， 并且开口和相应的第一扇出电路结构层形成凹陷。 两个功率元件分别嵌入两个凹面。 两个功率元件通过第一导电结构彼此电连接。 设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。
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公开(公告)号：US20160172285A1
公开(公告)日：2016-06-16
申请号：US14965909
申请日：2015-12-11
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
IPC: H01L23/495 , H01L25/07 , H01L23/498 , H01L25/18
CPC classification number: H01L23/49575 , H01L23/13 , H01L23/3735 , H01L23/492 , H01L23/49562 , H01L23/49568 , H01L23/49811 , H01L23/49861 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L25/072 , H01L25/18 , H01L2224/04105 , H01L2224/06181 , H01L2224/2518 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2224/83447 , H01L2924/00014 , H01L2224/291 , H01L2924/014
Abstract: A power module includes a first substrate, at least two power elements, at least one first conductive structure and at least one leadframe. The first substrate includes a dielectric frame, two first fan-out circuit structure layers and two dielectric plates. The two first fan-out circuit structure layers are respectively disposed on two opposite surfaces of the dielectric frame, the two dielectric plates are respectively disposed on the two first fan-out circuit structure layers, each of the dielectric plates has at least one opening, and the opening and the corresponding first fan-out circuit structure layer form a concavity. The two power elements are respectively embedded in the two concavities. The two power elements are electrically connected to each other through the first conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.
Abstract translation: 功率模块包括第一衬底，至少两个功率元件，至少一个第一导电结构和至少一个引线框架。 第一基板包括电介质框架，两个第一扇出电路结构层和两个电介质板。 两个第一扇出电路结构层分别设置在电介质框架的两个相对表面上，两个电介质板分别设置在两个第一扇出电路结构层上，每个电介质板具有至少一个开口， 并且开口和相应的第一扇出电路结构层形成凹陷。 两个功率元件分别嵌入两个凹面。 两个功率元件通过第一导电结构彼此电连接。 设置在第一基板处的引线框架电连接到两个功率元件，并且部分地延伸到第一基板的外部。
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公开(公告)号：US20190251214A1
公开(公告)日：2019-08-15
申请号：US16022705
申请日：2018-06-29
Applicant: Industrial Technology Research Institute
Inventor： Wei Li , Yu-Lin Chao , Chih-Ming Shen , Ming-Chi Tai , Miao-Zhen Hong
IPC: G06F17/50 , B29C64/386 , B33Y50/02 , G06T17/00 , B33Y10/00
CPC classification number: G06F17/5009 , B29C64/386 , B33Y10/00 , B33Y50/02 , G06T17/00 , G06T2207/10028
Abstract: A design method of an assistive device and an electronic system of assistive device design are provided. The design method of the assistive device are adapted for an electronic devices including a processor. The design method includes: obtaining a point cloud data of a limb part; determining a plurality of reference cross sections according to the point cloud data, wherein each of the reference cross sections is determined corresponding to bone protrusion feature points of the point cloud data, wherein the bone protrusion feature points are corresponding to the bony prominences of the limb parts respectively; establishing an initial digital model of the assistive device according to the reference cross sections; and performing a structural simulation analysis according to the initial digital model and design limitations to obtain a product digital model of the assistive device.
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公开(公告)号：US09807914B2
公开(公告)日：2017-10-31
申请号：US14788808
申请日：2015-07-01
Applicant: Industrial Technology Research Institute
Inventor： Chun-Kai Liu , Yu-Lin Chao
IPC: H05K1/02 , H05K7/14 , H05K7/20 , H01L23/473 , H01L25/07
CPC classification number: H05K7/20927 , H01L23/473 , H01L25/07 , H05K1/028 , H05K7/1432 , H05K7/20918
Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
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公开(公告)号：US20160157384A1
公开(公告)日：2016-06-02
申请号：US14788808
申请日：2015-07-01
Applicant: Industrial Technology Research Institute
Inventor： Chun-Kai Liu , Yu-Lin Chao
CPC classification number: H05K7/20927 , H01L23/473 , H01L25/07 , H05K1/028 , H05K7/1432 , H05K7/20918
Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
Abstract translation: 提供了包括多个基板，多个功率器件和散热组件的功率模块。 基板位于不同的平面上并且围绕轴线。 每个基板沿轴线延伸。 彼此电连接的功率器件分别设置在基板上。 散热组件设置在基板上并与功率器件相对。 从功率器件产生的热量通过衬底转移到散热组件。
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