公开(公告)号：US20170146339A1

公开(公告)日：2017-05-25

申请号：US14983053

申请日：2015-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiang-Chun WEI ,  Yi-Sha KU ,  Chia-Hung CHO ,  Chieh-Yu WU ,  Chun-Wei LO ,  Chih-Hsiang LIU

IPC: G01B11/22 ,  G01B11/06

CPC classification number: G01B11/22 ,  G01B11/0616 ,  G01B11/2441 ,  G01B2210/56 ,  H01L22/12

Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.