公开(公告)号：US20240331178A1

公开(公告)日：2024-10-03

申请号：US18308223

申请日：2023-04-27

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hung CHO ,  Yi-Sha KU ,  Cheng-Kang LEE

IPC: G06T7/521 ,  G01B11/22

CPC classification number: G06T7/521 ,  G01B11/22 ,  G06T2207/10028

Abstract: A measuring device includes a light source unit, a light modulation unit, a spectrum sensing unit, an image sensing unit, and a processing unit. The light source unit projects a first light path to a sample and receives a second light path reflected from the sample. The light module unit tilts the second light path to become a third light path or a fourth light path. The spectrum sensing unit receives the third light path to capture a spectrum corresponding to the microstructures. The image sensing unit receives the fourth light path to measure a captured image that corresponds to the sample. When the processing unit identifies the position of at least one of the microstructures in the captured image, the processing unit measures the depth of at least one of the microstructures from the spectrum for the identified area.

公开(公告)号：US20140333936A1

公开(公告)日：2014-11-13

申请号：US14270962

申请日：2014-05-06

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Yi CHANG ,  Chia-Hung CHO ,  Yi-Sha KU ,  Deh-Ming SHYU

IPC: G01B11/06 ,  H01L21/66

CPC classification number: H01L22/26 ,  G01B9/02007 ,  G01B11/0625 ,  G01B11/0675 ,  H01L22/12

Abstract: In a thickness measuring system for a bonding layer according to an exemplary embodiment, an optical element changes the wavelength of a first light source to enable at least one second light source propagating through a bonding layer to be incident to an object, wherein the bonding layer has an upper interface and a lower interface that are attached to the object; and an optical image capturing and analysis unit receives a plurality of reflected lights from the upper and the lower interfaces to capture a plurality of interference images of different wavelengths, and analyzes the intensity of the plurality of interference images to compute the thickness information of the bonding layer.

Abstract translation: 在根据示例性实施例的用于接合层的厚度测量系统中，光学元件改变第一光源的波长，使得能够通过粘合层传播的至少一个第二光源入射到物体，其中，接合层 具有附接到对象的上界面和下界面; 并且光学图像捕获和分析单元从上界面和下界面接收多个反射光以捕获多个不同波长的干涉图像，并且分析多个干涉图像的强度以计算粘合的厚度信息 层。

公开(公告)号：US20210080252A1

公开(公告)日：2021-03-18

申请号：US16717425

申请日：2019-12-17

Applicant: Industrial Technology Research Institute

Inventor： Chia-Hung CHO ,  Po-Yi CHANG ,  Yi-Sha KU ,  Kai-Ping CHUANG ,  Chih-Hsiang LIU ,  Fu-Cheng YANG

IPC: G01B11/25 ,  G06K9/32 ,  G06T7/521

Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.

公开(公告)号：US20170045355A1

公开(公告)日：2017-02-16

申请号：US14974892

申请日：2015-12-18

Applicant: Industrial Technology Research Institute

Inventor： Yi-Chen HSIEH ,  Chia-Liang YEH ,  Chia-Hung CHO ,  Yi-Chang CHEN ,  Yi-Sha KU ,  Chun-Wei LO

IPC: G01B11/24

CPC classification number: G01B11/24 ,  G01B2210/56 ,  H01L22/12

Abstract: A scattering measurement system is provided, including: a light source generator for generating a detection light beam with multi-wavelengths, wherein the detection light beam is incident on an object so as to generate a plurality of multi-order diffraction light beams with three-dimensional feature information; a spatial filter for filtering out zero-order light beams from the plurality of multi-order diffraction light beams; and a detector having a photosensitive array for receiving the plurality of multi-order diffraction light beams filtered out by the spatial filter and converting the filtered plurality of multi-order diffraction light beams into multi-order diffraction signals with the three-dimensional feature information. As such, the three-dimensional structure of the object can be obtained by comparing the multi-order diffraction signals with a database.

Abstract translation: 提供了一种散射测量系统，包括：用于产生具有多波长的检测光束的光源发生器，其中检测光束入射到物体上，以便产生多个三阶衍射光束， 三维特征信息; 用于滤除来自所述多个多级衍射光束的零级光束的空间滤波器; 以及检测器，其具有用于接收由空间滤波器滤除的多个多级衍射光束的光敏阵列，并将经滤波的多个多阶衍射光束转换成具有三维特征信息的多阶衍射信号。 因此，可以通过将多阶衍射信号与数据库进行比较来获得对象的三维结构。

公开(公告)号：US20170146339A1

公开(公告)日：2017-05-25

申请号：US14983053

申请日：2015-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiang-Chun WEI ,  Yi-Sha KU ,  Chia-Hung CHO ,  Chieh-Yu WU ,  Chun-Wei LO ,  Chih-Hsiang LIU

IPC: G01B11/22 ,  G01B11/06

CPC classification number: G01B11/22 ,  G01B11/0616 ,  G01B11/2441 ,  G01B2210/56 ,  H01L22/12

Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.

公开(公告)号：US20170082536A1

公开(公告)日：2017-03-23

申请号：US15369190

申请日：2016-12-05

Applicant: Industrial Technology Research Institute

Inventor： Chia-Liang YEH ,  Yi-Chang CHEN ,  Yi-Sha KU ,  Chun-Wei LO

IPC: G01N21/47

CPC classification number: G01N21/4788 ,  G01B11/24 ,  G01B2210/56 ,  G01N21/4785 ,  G01N21/4795 ,  G01N2021/4711 ,  G01N2201/068 ,  H01L22/00 ,  H01L22/12

Abstract: A scattering measurement system is provided, including: a light source generator for generating a detection light beam with discontinuous multi-wavelengths, and generating a multi-order diffraction light beam with three-dimensional feature information when the detection light beam is incident on an object; a detector having a photosensitive array for receiving and converting the multi-order diffraction light beam into multi-order diffraction signals with the three-dimensional feature information; and a processing module for receiving the multi-order diffraction signals and comparing the multi-order diffraction signals with multi-order diffraction feature patterns in a database so as to analyze the three-dimensional feature information of the object.