公开(公告)号：US12174596B2

公开(公告)日：2024-12-24

申请号：US17135729

申请日：2020-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yuan-Chieh Lo ,  Yu-Hsun Wang ,  Pei-Chun Lin ,  Chih-Hsuan Shih ,  Shu Huang

IPC: G05B13/04 ,  B24B51/00 ,  G05B17/00

Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.

公开(公告)号：US20200156211A1

公开(公告)日：2020-05-21

申请号：US16233859

申请日：2018-12-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Peng Kuan ,  Chih-Hsuan Shih ,  Kuo-Feng Hung ,  Yen-Chung Chang ,  Hung-Hsiu Yu

IPC: B24B51/00 ,  B25J11/00 ,  B24B21/16 ,  B24B49/00

Abstract: A method for controlling polishing and grinding is provided, including: generating an initial polishing and grinding trajectory for robot movements based on a three-dimensional contour of a work piece; adjusting the initial polishing and grinding trajectory based on a first optimized adjustment value and generating an optimized polishing and grinding trajectory; and evaluating the polishing and grinding quality of the work piece and using the polishing and grinding quality to generate a second optimized adjustment value.

公开(公告)号：US11685104B2

公开(公告)日：2023-06-27

申请号：US16985845

申请日：2020-08-05

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shang-Kun Li ,  Chih-Hsuan Shih

IPC: B29C53/80 ,  B29C53/56

CPC classification number: B29C53/8041 ,  B29C53/564

Abstract: A dynamic correction system of a manufacturing process using wire is provided. The dynamic correction system includes a driving device, a path sensor, and a controller. The driving device is configured to: drive a carrier with a motion parameter and encapsulate the carrier with a wire. The path sensor is configured to obtain an actual path information of the wire encapsulating the carrier. The controller is configured to: obtain an actual path of the wire encapsulating the carrier according to the actual path information; obtain an actual path difference between a target path and the actual path; determine whether the actual path difference is greater than a predetermined error; and, when the actual path difference is greater than the predetermined error, control the driving device to change the motion parameter to cause the actual path of the wire encapsulating the carrier to approach the target path.

公开(公告)号：US10540779B2

公开(公告)日：2020-01-21

申请号：US15847089

申请日：2017-12-19

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Hsuan Shih ,  Kuang-Yu Wu ,  Shang-Kun Li ,  Shu Huang

IPC: G06K9/00 ,  G06T7/70 ,  H04N5/225 ,  B25J9/16 ,  H04N13/204 ,  G05B19/02

Abstract: A posture positioning system for machine and the method thereof are provided. The system mainly consists of at least a depth camera mount on a robot to scan points of cloud of the machine, and a processing unit to apply an algorithm with the points of cloud and a contour vector file of the machine to obtain a transfer relationship. The processing unit further obtains a spatial relationship by a matrix calculation with the transfer relationship and a position relationship which exists between the robot and the depth camera. A route generating module of the processing unit generates, if needed, a moving route for the robot according to the spatial relationship.