公开(公告)号：US20200324537A1

公开(公告)日：2020-10-15

申请号：US16717194

申请日：2019-12-17

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pei-Chi CHIEN ,  Chun-Chen CHIANG ,  Ping-Chen CHEN ,  Hsien-Kuang LIN

IPC: B32B37/00 ,  H01L21/683

Abstract: An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.

公开(公告)号：US20130152737A1

公开(公告)日：2013-06-20

申请号：US13707931

申请日：2012-12-07

Applicant: Industrial Technology Research Institute

Inventor： Lien-Tai CHEN ,  Ruoh-Huey UAN ,  Tsing-Tang SONG ,  Zhi-Long CHEN ,  Chun-Chen CHIANG ,  Ya-Hui LIN

IPC: B22F9/18

CPC classification number: B22F9/18 ,  B22F1/0025 ,  B22F9/24 ,  B22F2301/255 ,  B82Y40/00

Abstract: Disclosed is a method for preparing silver nanowire. The method includes: providing a first solution and a second solution; mixing the first solution and the second solution to obtain a third solution including a plurality of silver nanowires; and performing a purification procedure on the third solution to obtain the silver nanowires. Particularly, the first solution includes a capping agent dispersed in a first alcohol solvent, and the second solution includes a silver salt and a metal precursor dispersed in a second alcohol solvent, wherein the metal precursor has a formula: MXn or MXn.m(H2O) wherein M is Cu2+, Sn4+, or Ni2+, X is Cl−, Br−, I−, SCN−, SO42−, NO3−, or C2O42−, n is 1-4, m is 1-6, and M has a valence equal to the absolute value of the product of n and a valence of X.

Abstract translation: 公开了一种制备银纳米线的方法。 该方法包括：提供第一溶液和第二溶液; 混合第一溶液和第二溶液以获得包含多个银纳米线的第三溶液; 并在第三溶液上进行纯化程序以获得银纳米线。 特别地，第一溶液包括分散在第一醇溶剂中的封端剂，第二溶液包括分散在第二醇溶剂中的银盐和金属前体，其中金属前体具有下式：MXn或MXn.m（H 2 O ）其中M为Cu2 +，Sn4 +或Ni2 +，X为Cl-，Br-，I-，SCN-，SO42-，NO3-或C2O42-，n为1-4，m为1-6，M为 的价数等于n的乘积和X的化合价的绝对值。

公开(公告)号：US20220410550A1

公开(公告)日：2022-12-29

申请号：US17896582

申请日：2022-08-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pei-Chi CHIEN ,  Chun-Chen CHIANG ,  Ping-Chen CHEN ,  Hsien-Kuang LIN

IPC: B32B37/00 ,  H01L21/683

Abstract: An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.