公开(公告)号：US09812629B2

公开(公告)日：2017-11-07

申请号：US13846211

申请日：2013-03-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiao-Hsuan Hsu ,  Chun-Hu Cheng ,  Ya-Wen Chou ,  Yu-Li Lin

IPC: H01L35/30 ,  H01L35/08 ,  B82Y30/00

CPC classification number: H01L35/30 ,  B82Y30/00 ,  H01L35/08 ,  Y10S977/734 ,  Y10S977/742 ,  Y10S977/762

Abstract: The disclosure provides a thermoelectric conversion structure and its use in heat dissipation device. The thermoelectric conversion structure includes a thermoelectric element, a first electrode and an electrically conductive heat-blocking layer. The thermoelectric element includes a first end and a second end opposite to each other. The first electrode is located at the first end of the thermoelectric element. The electrically conductive heat-blocking layer is between the thermoelectric element and the first electrode.