公开(公告)号：US20230264177A1

公开(公告)日：2023-08-24

申请号：US17846433

申请日：2022-06-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hung-Yuan HSIEH

IPC: B01J23/50 ,  C23C18/42 ,  C23C28/02 ,  B01J33/00 ,  B01J35/00

CPC classification number: B01J23/50 ,  C23C18/42 ,  C23C28/023 ,  B01J33/00 ,  B01J35/004

Abstract: A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.