Signal sensing module and ultrasonic probe using the same

    公开(公告)号:US11333634B2

    公开(公告)日:2022-05-17

    申请号:US17078300

    申请日:2020-10-23

    Inventor: Kuo-Tso Chen

    Abstract: A signal sensing module includes a substrate, a sensing electrode, a piezoresistive material layer and a sensing circuit. The substrate has a surface. The sensing electrode is disposed on the substrate and is exposed from the surface. The piezoresistive material layer is formed on the surface and covers the sensing electrode. The piezoresistive material layer has a resistance value. The sensing circuit is disposed in the substrate and adapted to sense a change of resistance value when a pressure wave passes through the piezoresistive material layer.

    Electrical stimulation device and method

    公开(公告)号:US12201840B2

    公开(公告)日:2025-01-21

    申请号:US17135108

    申请日:2020-12-28

    Abstract: An electrical stimulation device is provided. The electrical stimulation device includes a boost circuit, a voltage selecting circuit and a control circuit. The boost circuit generates a plurality of voltages, wherein the voltages have different voltage values. The voltage selecting circuit is coupled to the boost circuit and selects one voltage according to a reference voltage on a tissue impedance to generate an output voltage. The control circuit is coupled to the boost circuit and in response to electrical stimulation; it transmits a control signal to enable the boost circuit.

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