RESIN FORMULATIONS, RESIN POLYMERS AND COMPOSITE MATERIALS COMPRISING THE RESIN POLYMERS
    1.
    发明申请
    RESIN FORMULATIONS, RESIN POLYMERS AND COMPOSITE MATERIALS COMPRISING THE RESIN POLYMERS 有权
    树脂配方,树脂聚合物和包含树脂聚合物的复合材料

    公开(公告)号:US20160145373A1

    公开(公告)日:2016-05-26

    申请号:US14805094

    申请日:2015-07-21

    Abstract: A resin formulation is provided. The resin formulation includes carboxy anhydride at 100 parts by weight, first diisocyanate having the following formula (I) at 20-90 parts by weight, second diisocyanate having the following formulas (II), (III) or a combination thereof at 45-103 parts by weight, and bismaleimide (BMI) at 50-200 parts by weight. A resin polymer and a composite material including the resin polymer are also provided. In formulas (I), (II) and (III), A includes benzene or cyclohexane, Q includes C1-C12 alkylene, —O—, —S— or —SO2—, X includes —H, —CH3 or —CH2CH3, R1 includes —H, —CH3 or —CH2CH3, and E includes —H, —CH3 or —CH2CH3.

    Abstract translation: 提供树脂配方。 该树脂配方包括在100重量份的羧酸酐,在20-90重量份下具有下式(I)的第一二异氰酸酯,具有下式(II),(III)的第二二异氰酸酯或其组合在45-103 重量份,和50-200重量份的双马来酰亚胺(BMI)。 还提供了树脂聚合物和包含树脂聚合物的复合材料。 在式(I),(II)和(III)中,A包括苯或环己烷,Q包括C1-C12亚烷基,-O - , - S-或-SO2-,X包括-H,-CH3或-CH2CH3, R1包括-H,-CH 3或-CH 2 CH 3,E包括-H,-CH 3或-CH 2 CH 3。

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