公开(公告)号：US10137752B2

公开(公告)日：2018-11-27

申请号：US14981118

申请日：2015-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua Chang ,  Min-Chuan Wu ,  Wen-Shu Chiang ,  Li-Song Lin ,  Kou-Tzeng Lin

IPC: B60H1/00 ,  H01L23/38

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.