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公开(公告)号:US20220082900A1
公开(公告)日:2022-03-17
申请号:US17094734
申请日:2020-11-10
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Zih-Yi LI , Ying-Tso LIN , Shang-Yu HSU , Ying-Hui YANG
Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.
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公开(公告)号:US20250091158A1
公开(公告)日:2025-03-20
申请号:US18531410
申请日:2023-12-06
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Zih-Yi LI , Ping-Han WU , Yi-Chi LEE , Shang-Yu HSU , Ji-Bin HORNG
IPC: B23K26/082
Abstract: A continuous laser processing system for internal modification of transparent materials includes a pulse laser device, a scanning device, a processing platform and a control device. The pulse laser device is configured to output a laser beam. The scanning device includes a mirror group controller and a mirror group and controlled to guide the laser beam to the transparent material, wherein the mirror group is disposed at an output path of the laser beam. The processing platform is configured to carry the transparent material and controlled to move. The control device is electrically connected to the scanning device and the processing platform, and is configured to control the scanning device to form a processing trajectory at the transparent material at a scanning speed, and to control the processing platform to move at a translation speed, wherein the scanning speed is at least 20 times the translation speed.
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公开(公告)号:US20240066635A1
公开(公告)日:2024-02-29
申请号:US17960756
申请日:2022-10-05
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Yi-Chi LEE , Bo-Han CHEN , Chih-Hsuan LU , Ping-Han WU , Zih-Yi LI , Shang-Yu HSU
IPC: B23K26/38 , B23K26/0622 , H01L21/268
CPC classification number: B23K26/38 , B23K26/0622 , H01L21/268 , H01L29/1608
Abstract: A laser machining device includes a pulsed laser generator, an accommodation chamber, a bandwidth broadening unit and a pulse compression unit. The pulsed laser generator is configured to emit a pulsed laser. The accommodation chamber has a gas inlet. The bandwidth broadening unit is disposed in the accommodation chamber, and is configured to broaden a frequency bandwidth of the pulsed laser to obtain a broad bandwidth pulsed laser. The pulse compression unit is disposed in the accommodation chamber. The bandwidth broadening unit and the pulse compression unit are arranged in order along a laser propagation path, and the pulse compression unit is configured to compress a pulse duration of the broad bandwidth pulsed laser.
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