LASER PROCESSING SYSTEM
    1.
    发明申请

    公开(公告)号:US20220082900A1

    公开(公告)日:2022-03-17

    申请号:US17094734

    申请日:2020-11-10

    Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.

    LASER MACHINING SYSTEM UTILIZING THERMAL RADIATION IMAGE AND METHOD THEREOF
    2.
    发明申请
    LASER MACHINING SYSTEM UTILIZING THERMAL RADIATION IMAGE AND METHOD THEREOF 有权
    利用热辐射图像的激光加工系统及其方法

    公开(公告)号:US20150144604A1

    公开(公告)日:2015-05-28

    申请号:US14143829

    申请日:2013-12-30

    CPC classification number: B23K26/034 B23K26/04 B23K26/08

    Abstract: A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.

    Abstract translation: 公开了一种激光加工系统及其方法。 所公开的激光加工系统包括激光发生器,阵列光电检测器,处理器和位置控制器。 激光发生器被配置为经由第一光路将激光发射到工件上。 阵列光电检测器被配置为经由与第一光路不同的第二光路接收来自工件的热辐射,以产生热辐射图像。 电耦合到激光发生器和阵列光电检测器的处理器被配置为计算热辐射图像的温度重心并根据温度重心产生距离控制信号。 电耦合到处理器的位置控制器由距离控制信号控制,以使激光加工系统之间的当前距离等于工作距离。

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