公开(公告)号：US20210257279A1

公开(公告)日：2021-08-19

申请号：US17141035

申请日：2021-01-04

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Sheng-Che HUNG ,  Shih-Hsien WU ,  Yu-Wei HUANG

IPC: H01L23/485 ,  H05K1/11 ,  H05K3/30 ,  H05K3/42

Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.