公开(公告)号：US11247414B2

公开(公告)日：2022-02-15

申请号：US16660694

申请日：2019-10-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chang-Chou Li ,  Yen Bor Fang ,  Shun-Sheng Ko ,  Teng-Yen Wang ,  Yang-Cheng Lin

IPC: B29C70/38 ,  B65H35/00 ,  B29C53/80

Abstract: The disclosure relates to a tape laying apparatus configured to lay prepreg tape to mould surface. The tape laying apparatus includes a tape supply spool, a compaction head, a cutting tool and at least one travel distance adjustment component. The tape supply spool is configured for the prepreg tape to be wound thereon. The compaction head is configured for delivering the prepreg tape to the mould surface from the tape supply spool. The cutting tool is movable along a cutting path. The cutting tool is configured to cut the prepreg tape passing through the cutting path. The at least one travel distance adjustment component is movably located between the cutting path and the compaction head and configured to push the prepreg tape passing through the cutting path so as to increase or decrease a travel distance of the prepreg tape from the cutting path to the compaction head.