公开(公告)号：US20230203238A1

公开(公告)日：2023-06-29

申请号：US17866043

申请日：2022-07-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wen-Pin TING ,  Kuei-Yi CHUANG ,  Yu-Hsiang HSIAO ,  Wei-Ta YANG

IPC: C08G59/28 ,  C08G59/40

CPC classification number: C08G59/28 ,  C08G59/4014

Abstract: A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of




wherein R1 is single bond, —O—,




(b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.

公开(公告)号：US20190194408A1

公开(公告)日：2019-06-27

申请号：US15856514

申请日：2017-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ,  ITEQ CORPORATION

Inventor： Feng-Po TSENG ,  Wen-Pin TING ,  Kuo-Chan CHIOU

IPC: C08J5/24 ,  C08G61/10 ,  C08K5/00 ,  C08K5/14 ,  C08K5/17 ,  C08K5/23 ,  C08K5/3492 ,  C08K5/5415 ,  B32B33/00 ,  H05K1/05

Abstract: A resin composition is provided, which includes 1 part by weight of a thermally conductive resin, 0.001 to 0.05 parts by weight of radical initiator, and 0.05 to 0.30 parts by weight of crosslinking agent. The chemical structure of the thermally conductive resin is in which R1 is —CH2—, —C(═O)—, or —(CH2)—(C6H5)—, and R2 is H or CH3.

公开(公告)号：US20220372189A1

公开(公告)日：2022-11-24

申请号：US17497673

申请日：2021-10-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Wen-Pin TING ,  Kuei-Yi CHUANG ,  Shih-Yao LIANG ,  Yen-Chun LIU

IPC: C08F222/10 ,  C08F216/12 ,  C08F222/22 ,  C08F222/20 ,  C08F236/04 ,  C08F222/40

Abstract: A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of in which each of R1 is independently H or CH3, and n=1-4. R2 is a single bond, —O—, Each of R3 is independently