摘要:
Device for the additive production of three-dimensional components (2), namely a laser melting device or laser sintering device, in which a component (2) is produced by successive solidifying of individual layers (3) made from solidifiable construction material, by the effect of radiation (4), through melting of the construction material (5), wherein the dimensions and/or temperature of the melt area (6) generated by a point-shaped or line-shaped energy input can be captured by a sensor device (8) of a process monitoring system, and sensor values for evaluation of a component quality can be deduced therefrom, wherein the radiation (9) created by the melt area and used for the generation of the sensor values passes through the scanner used for the melt energy input, and is guided from there to the sensor device (8) of the process monitoring system, wherein an optical focus tracking device (20) is arranged in the radiation path used for generation of the sensor values between the scanner (10) and the sensor device (8) of the process monitoring system, which optical focus tracking device can be controlled by electronic machine data for focus tracking.
摘要:
The disclosed embodiments relate to the monitoring and control of additive manufacturing. In particular, a method is shown for removing errors inherent in thermal measurement equipment so that the presence of errors in a product build operation can be identified and acted upon with greater precision. Instead of monitoring a grid of discrete locations on the build plane with a temperature sensor, the intensity, duration and in some cases position of each scan is recorded in order to characterize one or more build operations.
摘要:
The present disclosure provides three-dimensional (3D) printing methods, apparatuses, and systems using, inter alfa, a controller that regulates formation of at least one 3D object (e.g., in real time during the 3D printing); and a non-transitory computer-readable medium facilitating the same. For example, a controller that regulates a deformation of at least a portion of the 3D object. The control may be in situ control. The control may be real-time control during the 3D printing process. For example, the control may be during a physical-attribute pulse. The present disclosure provides various methods, apparatuses, systems and software for estimating the fundamental length scale of a melt pool, and for various tools that increase the accuracy of the 3D printing.
摘要:
An additive manufacturing temperature controller/temperature sensor uses one or more spectrophotometric sensors to monitor temperature of successive layers and preferably localized sections of successive layers of a melt pool, and transients thereof, of an object being generated for the purpose of dynamic control of the additive manufacturing device and/or quality control of the generated object manufactured with the additive manufacturing device. Generally, the additive manufacturing temperature controller/sensor apparatus monitors temperature of a section of the object during manufacture as a function of wavelength, time, position, and/or angle to determine melt extent in terms of radius and/or depth.
摘要:
In one embodiment, an optical device having a convex lens, a concave lens and a mirror member is provided. The convex lens is arranged on an axis and has a convex surface at one side in a direction of the axis. The convex lens reflects a first wavelength light and transmits a second wavelength light. The concave lens is arranged on the axis and at the other side in a direction of the axis and having a concave surface. The mirror member has a reflective surface opposing the convex surface and is arranged apart from an outer circumference of the convex lens.
摘要:
Laser annealing systems and methods for annealing a semiconductor wafer with ultra-short dwell times are disclosed. The laser annealing systems can include one or two laser beams that at least partially overlap. One of the laser beams is a pre-heat laser beam and the other laser beam is the annealing laser beam. The annealing laser beam scans sufficiently fast so that the dwell time is in the range from about 1 μs to about 100 μs. These ultra-short dwell times are useful for annealing product wafers formed from thin device wafers because they prevent the device side of the device wafer from being damaged by heating during the annealing process. Embodiments of single-laser-beam annealing systems and methods are also disclosed.
摘要:
The invention concerns a method for producing three-dimensional objects (6) layer by layer using a powdery material (7) which can be solidified by irradiating it with a high-energy beam (4), said method comprising the steps of: applying a first layer of powdery material onto a working area (5); solidifying a part of said first layer by irradiating it with a high-energy beam; and applying a second layer (8) of powdery material onto the first, partly solidified layer. The invention is characterized in that the method comprises the step of: determining a rate at which the temperature of the second layer (8) increases after application onto the first layer. The invention also concerns an apparatus configured to operate according to the above method.
摘要:
Atomic Layer Deposition (ALD) is used for heteroepitaxial film growth at reaction temperatures ranging from 80-400° C. The substrate and film materials are preferably selected to take advantage of Domain Matched Epitaxy (DME). A laser annealing system is used to thermally anneal deposition layers after deposition by ALD. In preferred embodiments a silicon substrate is overlaid with an AIN nucleation layer and laser annealed. Thereafter a GaN device layers is applied over the AIN layer by an ALD process and then laser annealed. In a further example embodiment a transition layer is applied between the GaN device layer and the AIN nucleation layer. The transition layer comprises one or more different transition material layers each comprising a AlxGa1-x compound wherein the composition of the transition layer is continuously varied from AIN to GaN.
摘要翻译:原子层沉积(ALD)用于在80-400℃的反应温度下进行异质外延膜生长。优选选择底物和膜材料以利用域匹配外延(DME)。 激光退火系统用于通过ALD沉积后对沉积层进行热退火。 在优选实施例中,硅衬底用AIN成核层覆盖并进行激光退火。 此后,通过ALD工艺将GaN器件层施加在AIN层上,然后进行激光退火。 在另一示例实施例中,将过渡层施加在GaN器件层和AIN成核层之间。 过渡层包括一个或多个不同的过渡材料层,每个过渡材料层均包含Al x Ga 1-x化合物,其中过渡层的组成从AIN到GaN连续变化。
摘要:
A method for controlling, during metal processing, the input energy from an energy point source that directs focused emitted energy onto a metal workpiece having a geometry, wherein the directed focused emitted energy creates a melt pool and hot zone on the workpiece that emit radiation during the process. The method comprises determining a wavelength range for the emitted radiation that is within a spectral range of radiation emitted by the hot zone during processing that is comparatively high in amount in relation to the amount of radiation emitted by the melt pool in that spectral range during processing; directing the beam onto the workpiece to generate a melt pool and hot zone on the structure; measuring the intensity of radiation within the determined wavelength range; and adjusting the input energy from the energy point source based upon the measured intensity of radiation within the determined wavelength range.
摘要:
A temperature sensing apparatus configured to measure a temperature distribution of a surface to be measured is provided. The temperature sensing apparatus includes a lens set, a filtering module, a plurality of sensor arrays, and a processing unit. The lens set is configured to receive radiation from the surface to be measured. The filtering module is configured to filter the radiation from the lens set into a plurality of radiation portions respectively having different wavelengths. The sensor arrays are configured to respectively sense the radiation portions. The processing unit is configured to calculate an intensity ratio distribution of the radiation between the different wavelengths according to the radiation portions respectively sensed by the sensor arrays and determine the temperature distribution according to the intensity ratio distribution. A laser processing system and a temperature measuring method are also provided.