公开(公告)号：US20180159014A1

公开(公告)日：2018-06-07

申请号：US15394190

申请日：2016-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ying-Jung CHIANG ,  Ren-Der JEAN ,  Hong-Ching LIN ,  Hsu-Shen CHU

IPC: H01L35/32 ,  H01L35/16 ,  H01L35/18 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/16 ,  H01L35/18 ,  H01L35/26 ,  H01L35/34

Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.

公开(公告)号：US20200211771A1

公开(公告)日：2020-07-02

申请号：US16234015

申请日：2018-12-27

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-An LU ,  Ying-Jung CHIANG ,  Yuan-Ling TSAI

IPC: H01G4/12 ,  H01B3/00 ,  H01G4/33 ,  H01G4/30 ,  H01G4/258

Abstract: A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

公开(公告)号：US20200259063A1

公开(公告)日：2020-08-13

申请号：US16862724

申请日：2020-04-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ying-Jung CHIANG ,  Ren-Der JEAN ,  Hong-Ching LIN ,  Hsu-Shen CHU

IPC: H01L35/32 ,  H01L35/26 ,  H01L35/34 ,  H01L35/18 ,  H01L35/16

Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.