公开(公告)号：US20140306327A1

公开(公告)日：2014-10-16

申请号：US13862398

申请日：2013-04-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Hans-Joachim SCHULZE ,  Johannes BAUMGARTL ,  Gerald LACKNER ,  Anton MAUDER ,  Francisco Javier SANTOS RODRIGUEZ

IPC: H01L21/52 ,  H01L23/053 ,  H01L21/78 ,  H01L23/043

CPC classification number: H01L21/52 ,  H01L21/50 ,  H01L21/78 ,  H01L23/04 ,  H01L23/043 ,  H01L23/053 ,  H01L24/11 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00

Abstract: A semiconductor device includes a device carrier and a semiconductor chip attached to the device carrier. Further, the semiconductor device includes a lid having a recess. The lid includes a semiconductor material and is attached to the device carrier such that the semiconductor chip is accommodated in the recess.

Abstract translation: 半导体器件包括器件载体和附着于器件载体的半导体芯片。 此外，半导体器件包括具有凹部的盖。 盖子包括一个半导体材料，并附着在器件载体上，使半导体芯片容纳在凹槽中。

公开(公告)号：US20180261487A1

公开(公告)日：2018-09-13

申请号：US15951213

申请日：2018-04-12

Applicant: Infineon Technologies AG

Inventor： Francisco Javier SANTOS RODRIGUEZ ,  Gerald LACKNER ,  Josef UNTERWEGER

IPC: H01L21/683 ,  H01L21/304

Abstract: A wafer arrangement in accordance with various embodiments may include: a wafer; and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably coupled to one another so that the wafer support ring can be uncoupled from the wafer without causing damage to the wafer or the wafer support ring.