公开(公告)号：US20140306327A1

公开(公告)日：2014-10-16

申请号：US13862398

申请日：2013-04-13

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Hans-Joachim SCHULZE ,  Johannes BAUMGARTL ,  Gerald LACKNER ,  Anton MAUDER ,  Francisco Javier SANTOS RODRIGUEZ

IPC: H01L21/52 ,  H01L23/053 ,  H01L21/78 ,  H01L23/043

CPC classification number: H01L21/52 ,  H01L21/50 ,  H01L21/78 ,  H01L23/04 ,  H01L23/043 ,  H01L23/053 ,  H01L24/11 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00

Abstract: A semiconductor device includes a device carrier and a semiconductor chip attached to the device carrier. Further, the semiconductor device includes a lid having a recess. The lid includes a semiconductor material and is attached to the device carrier such that the semiconductor chip is accommodated in the recess.

Abstract translation: 半导体器件包括器件载体和附着于器件载体的半导体芯片。 此外，半导体器件包括具有凹部的盖。 盖子包括一个半导体材料，并附着在器件载体上，使半导体芯片容纳在凹槽中。