公开(公告)号：US20240392442A1

公开(公告)日：2024-11-28

申请号：US18695900

申请日：2023-05-22

Applicant: INOPLAZTECH CO., LTD.

Inventor： Deuk Yeon LEE ,  Chang Young LEE ,  Ja Eun LEE ,  Yeon Bi HAN

IPC: C23C16/509 ,  C23C16/44

Abstract: A plasma device for powder surface treatment using a horizontal electrode, according to the present invention, is advantageous in that, by placing powders on a flat plate-shaped horizontal electrode arranged in the horizontal direction and treating same with plasma, there is almost no loss of powder, and more rapid and uniform surface treatment is possible.

公开(公告)号：US20240001327A1

公开(公告)日：2024-01-04

申请号：US18036405

申请日：2021-10-06

Applicant: INOPLAZTECH CO., LTD.

Inventor： Deuk Yeon LEE ,  Chang Young LEE ,  Ja Eun LEE ,  Yeon Bi HAN

IPC: B01J19/08 ,  B01J19/10 ,  B01J19/12 ,  H05H1/46

CPC classification number: B01J19/088 ,  B01J19/10 ,  B01J19/129 ,  H05H1/466 ,  B01J2219/0894 ,  B01J2219/00635

Abstract: A powder treatment plasma device according to the present invention maximizes processing capacity for performing processing all at once, by stacking a plurality of flat and porous filter electrodes, and thus improves processing efficiency. In addition, since vibration is applied to the filter electrodes by using a vibration generator while causing powder to be adsorbed on surfaces of the filter electrodes by using an adsorption means, the powder can be evenly dispersed on the surfaces of the filter electrodes and mixed, and thus the powder can be evenly surface-treated.