公开(公告)号：US11837509B1

公开(公告)日：2023-12-05

申请号：US16920069

申请日：2020-07-02

Applicant: INPHI CORPORATION

Inventor： Hsu-Feng Chou ,  Keith Nellis ,  Loi Nguyen

IPC: H01L31/02 ,  H01L21/66 ,  G02B6/13 ,  G01M11/00 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H01L22/10 ,  G01M11/30 ,  G02B6/13 ,  H01L31/02325 ,  H01L31/1808

Abstract: A method of packaging the silicon photonics wafer for fabricating custom optical-electrical modules includes fabricating a wafer with multiple dies of silicon photonics circuits based on custom design and conducting electrical and optical tests of the silicon photonics circuits in wafer level. The method further includes preparing the wafer for next point of use. Additionally, the method includes performing post-wafer processing on the wafer received at the next point of use. The method further includes conducting post-process electrical tests of the silicon photonics circuits in wafer level. Furthermore, the method includes preparing the wafer with known-good-dies or a known-good-wafer identified for custom use. Moreover, the method includes performing custom process on the know good dies.