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Patent Agency Ranking
公开(公告)号：US11165509B1
公开(公告)日：2021-11-02
申请号：US16894622
申请日：2020-06-05
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Liang Ding , Mark Patterson , Roberto Coccioli , Steve Aboagye
IPC: H04B10/80 , H04B10/40 , H04J14/02 , H01L23/538 , H04B10/50
Abstract: A method for co-packaging multiple light engines in a switch module is provided. The method includes providing a module substrate with a minimum lateral dimension no greater than 110 mm. The module substrate is configured with a first mounting site at a center region and a plurality of second mounting sites distributed densely along the peripheral sides. The method includes disposing a main die with a switch processor chip at the first mounting site. The switch processor chip is configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. The method further includes mounting a plurality of chiplet dies respectively into the plurality of second mounting sites. Each chiplet die is configured to be a packaged light engine with a minimum lateral dimension to allow a maximum number of chiplet dies with
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公开(公告)号：US10892830B1
公开(公告)日：2021-01-12
申请号：US17033194
申请日：2020-09-25
Applicant: INPHI CORPORATION
Inventor： Ding Liang , Mark Patterson , Roberto Coccioli , Radhakrishnan L. Nagarajan
Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect.
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公开(公告)号：US11178473B1
公开(公告)日：2021-11-16
申请号：US16894611
申请日：2020-06-05
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Liang Ding , Mark Patterson , Roberto Coccioli , Steve Aboagye
Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.
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公开(公告)号：US11109515B1
公开(公告)日：2021-08-31
申请号：US16894639
申请日：2020-06-05
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Liang Ding , Mark Patterson , Roberto Coccioli , Steve Aboagye
Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.
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公开(公告)号：US10826613B1
公开(公告)日：2020-11-03
申请号：US16706450
申请日：2019-12-06
Applicant: INPHI CORPORATION
Inventor： Ding Liang , Mark Patterson , Roberto Coccioli , Radhakrishnan L. Nagarajan
Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chipand to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect.
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