公开(公告)号：US20240038705A1

公开(公告)日：2024-02-01

申请号：US17918038

申请日：2022-07-28

Applicant: INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES

Inventor： Yunzhi LING ,  Siliang HE ,  Jianguo MA ,  Yuhao BI ,  Xingyu LIU ,  Chuan HU ,  Zhitao CHEN

IPC: H01L23/00 ,  H01R4/58 ,  H01R43/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/73 ,  H01L24/92 ,  H01R4/58 ,  H01R43/00 ,  H01L2224/0345 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2224/16057 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/321 ,  H01L2224/73204 ,  H01L2224/81201 ,  H01L2224/81898 ,  H01L2224/81948 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/9205

Abstract: A substrate bonding method includes: providing a first and a second substrate; forming, on the first substrate, a first metal micro-bump array including first metal pillar(s) formed on the first substrate and first metal nanowires formed thereon and spaced apart from each other; forming, on the second substrate, a second metal micro-bump array including second metal pillar(s) formed on the second substrate and second metal nanowires formed thereon and spaced apart from each other; pressing the first substrate onto the second substrate, such that the first and second metal micro-bump arrays are positioned and staggered with each other, forming a physically interwoven interlocking structure between the first and second metal nanowires; applying a filling material between the first and second substrates; curing the filling material to form a bonding cavity; and then performing confined heating reflux on the first and second metal micro-bump arrays in the bonding cavity.