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公开(公告)号:US20240123480A1
公开(公告)日:2024-04-18
申请号:US18277856
申请日:2022-02-18
CPC分类号: B09B3/70 , B03C7/003 , B09B3/35 , C22B1/248 , C22B7/006 , H05K3/22 , B09B2101/17 , H05K2203/0783 , H05K2203/178
摘要: A method of delamination of a printed circuit board includes comminuting the printed circuit board, and soaking the comminuted PCB in a solvent system comprising at least two solvents. Once soaking has been completed the method includes separating solids, and electrostatically separating different specific solids from the separated solids.