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1.发明公开公开(公告)号：US20230374626A1
公开(公告)日：2023-11-23
申请号：US17746145
申请日：2022-05-17
发明人： WEIMEI LUO , DINESH TYAGI , MARK THOMAS BELLINO
CPC分类号： C22B15/0063 , B09B3/70 , C22B11/046 , C22B7/006 , B09B2101/17
摘要： The present invention is related generally to recovering metals from waste electronics, and more particularly to a process to recover copper and gold commonly found in waste printed circuit boards using a lixiviant containing a weak acid such as citric acid or acetic acid, a particular concentration of table salt and an oxidizer. By using this lixiviant, the copper found in the printed circuit board reacts to form copper salts and gold becomes detached. Importantly this recovery method of copper and gold found in waste PCBs is fast, does not pose environmental hazards and is economically feasible.
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2.发明授权公开(公告)号：US12054673B2
公开(公告)日：2024-08-06
申请号：US16333591
申请日：2018-05-28
发明人： Dean Pan , Yufeng Wu , Tieyong Zuo
CPC分类号： C10B53/00 , B03C1/30 , B09B3/40 , C10G1/00 , C22B1/005 , C22B7/001 , C22B7/005 , B03C2201/20 , B09B2101/17 , C10G2300/1003
摘要： A green resource-based method of thermal mass synergy in waste Integrated circuit board mainly includes carbonization cracking system, crushing and separation system, gasification cracking system and heat value utilization and comprehensive recovery system. Compared with existing techniques, carbonization cracking system can realize the dry distillation cracking of organic matter in waste integrated circuit board which converts carbon, hydrogen and other elements into fuel carbonized cracking gas and cracking oil, the heat from the combustion of the carbonization cracking gas of the invention provides the energy needed for the carbonization cracking to realize self-heating carbonization cracking. Carbonization cracking products are cracked and separated to solve the problems such as hard to break and organic coating metal caused by direct crushing and separation of traditional circuit boards which Improves crushing and separation effect; gasification cracking system achieves the comprehensive utilization of carbon, the gasified cracking gas can be used as a heat source for subsequent valuable metal recovery to further improve the utilization rate of calorific value. The invention has the characteristics of: high heat value utilization rate, low energy consumption, high metal recovery rate, short process recovery of valuable metal and no pollution of flue gas.
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公开(公告)号：US20240181467A1
公开(公告)日：2024-06-06
申请号：US18406613
申请日：2024-01-08
申请人： Sharp Pulse Corp.
IPC分类号： B02C19/18 , B02C23/10 , B09B3/35 , B09B101/17
CPC分类号： B02C19/18 , B02C23/10 , B09B3/35 , B09B2101/17
摘要： A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.
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公开(公告)号：US12097505B2
公开(公告)日：2024-09-24
申请号：US18406613
申请日：2024-01-08
申请人： Sharp Pulse Corp.
IPC分类号： B02C19/18 , B02C23/10 , B09B3/35 , B09B101/17
CPC分类号： B02C19/18 , B02C23/10 , B09B3/35 , B09B2101/17
摘要： A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.
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公开(公告)号：US12090518B2
公开(公告)日：2024-09-17
申请号：US17599236
申请日：2020-03-27
发明人： Katsushi Aoki , Hidetoshi Sasaoka
摘要： Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.
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公开(公告)号：US20240123480A1
公开(公告)日：2024-04-18
申请号：US18277856
申请日：2022-02-18
CPC分类号： B09B3/70 , B03C7/003 , B09B3/35 , C22B1/248 , C22B7/006 , H05K3/22 , B09B2101/17 , H05K2203/0783 , H05K2203/178
摘要： A method of delamination of a printed circuit board includes comminuting the printed circuit board, and soaking the comminuted PCB in a solvent system comprising at least two solvents. Once soaking has been completed the method includes separating solids, and electrostatically separating different specific solids from the separated solids.
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公开(公告)号：US11865546B2
公开(公告)日：2024-01-09
申请号：US18108614
申请日：2023-02-11
申请人： Sharp Pulse Corp.
IPC分类号： B02C19/18 , B09B3/35 , B02C23/10 , B09B101/17
CPC分类号： B02C19/18 , B02C23/10 , B09B3/35 , B09B2101/17
摘要： A system for processing compounds having constituent materials of different mechanical characteristics to extract their constituent materials. The system includes a kinetic impactor configured to impact, via a shockwave, compound particles of a preimpact mixture, thereby creating a postimpact mixture including (i) subparticles of 1st-constituent-material and (ii) reduced-compound particles including a 2nd constituent material.
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公开(公告)号：US20230415201A1
公开(公告)日：2023-12-28
申请号：US18340622
申请日：2023-06-23
发明人： Steve Budd , Scott Schoen
CPC分类号： B07C5/3422 , G06T7/001 , G06T7/0006 , B09B5/00 , B07C2501/0054 , G06T2207/30141 , G06T2207/30136 , B09B2101/17
摘要： An automated method for sorting circuit boards for recycling is described. The method includes scanning a layout design for a circuit board and comparing the scanned layout design with a database of circuit board layout designs. Each of the layout designs being associated with a respective precious metal content value. A match between the scanned layout design and one of the circuit board layout designs in the database is identified. The method then assigns a precious metal designation to the scanned circuit board based on the identified match. The precious metal designation corresponds to the precious metal content value associated with the matched circuit board layout from the database. The method also includes sorting the scanned circuit board into a group associated with the assigned precious metal designation.
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9.发明公开公开(公告)号：US20230374625A1
公开(公告)日：2023-11-23
申请号：US17746141
申请日：2022-05-17
发明人： WEIMEI LUO , DINESH TYAGI , MARK THOMAS BELLINO
CPC分类号： C22B15/0063 , B09B3/70 , C25C1/20 , C22B11/046 , C22B7/006 , B09B2101/17
摘要： The present invention is related generally to recovering metals from waste electronics, and more particularly to a process to recover copper and gold commonly found in waste printed circuit boards using a lixiviant containing a weak acid such as citric acid or acetic acid, a particular concentration of table salt and an oxidizer. By using this lixiviant, the copper found in the printed circuit board reacts to form copper salts and gold becomes detached. Importantly this recovery method of copper and gold found in waste PCBs is fast, does not pose environmental hazards and is economically feasible.
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公开(公告)号：US11819885B2
公开(公告)日：2023-11-21
申请号：US17598949
申请日：2020-03-27
发明人： Katsushi Aoki , Hidetoshi Sasaoka
IPC分类号： B07B9/00 , B03C1/23 , B09B3/35 , B07B4/08 , B09B101/17
CPC分类号： B07B9/00 , B03C1/23 , B07B4/08 , B09B3/35 , B03C2201/20 , B09B2101/17
摘要： Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
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