公开(公告)号：US10141241B2

公开(公告)日：2018-11-27

申请号：US14767843

申请日：2014-09-27

Applicant: INTEL CORPORATION

Inventor： Jeffory L. Smalley ,  Susan F. Smith ,  Mani Prakash ,  Tao Liu ,  Henry C. Bosak ,  Harvey R. Kofstad ,  Almanzo T. Ortiz

IPC: H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H01L25/065

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.