公开(公告)号：US09960105B2

公开(公告)日：2018-05-01

申请号：US13631939

申请日：2012-09-29

Applicant: INTEL CORPORATION

Inventor： Hongin Jiang ,  Arun Kumar C. Nallani ,  Wei Tan

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/48

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/48 ,  H01L23/49816 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00

Abstract: An apparatus comprises a substrate including a surface and a plurality of bonding pads positioned on the surface. The apparatus also includes a material comprising a solder positioned on the bonding pads and extending a distance outward therefrom. A first of the bonding pads in a first location on the substrate surface includes the solder extending a first distance outward therefrom. A second of the bonding pads in a second location on the substrate surface includes the solder extending a second distance outward therefrom. The first distance is different than the second distance. Other embodiments are described and claimed.