公开(公告)号：US20200003836A1

公开(公告)日：2020-01-02

申请号：US16024722

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Christopher J. NELSON ,  Shelby G. ROLLINS ,  Hiren V. TILALA ,  Matthew HENDRICKS ,  Sundar V. PATHY ,  Timothy J. CALLAHAN ,  Jared PAGER ,  James NEEB ,  Bradly INMAN ,  Stephen STURGES

IPC: G01R31/3183 ,  G01R31/3185

Abstract: Embodiments herein relate to apparatus, systems, and methods to compress a test pattern onto a field programmable gate array to test a device under test. This may include identifying values of a plurality of drive pins for a plurality of test cycles to apply to an input of the DUT for each of the plurality of test cycles, identifying values of a plurality of compare pins for the plurality of test cycles to compare an output of the DUT, respectively, for each of the plurality of test cycles, analyzing the identified values, compressing, based on the analysis, the values of the plurality of drive pins and the plurality of compare pins, and storing the compressed values on the FPGA.

公开(公告)号：US20240219452A1

公开(公告)日：2024-07-04

申请号：US18090422

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Prasoon JOSHI ,  Joseph BASILE ,  Eric BRUMMER ,  Evan FLEDELL ,  Joshua FREIER ,  Brett GROSSMAN ,  Jennifer HUENING ,  Matthew KIRSCH ,  James NEEB ,  Robert NESTING ,  Charles PETERSON ,  Ashraf REZAIE ,  Ling Hong TAN ,  Xianghong TONG ,  Vladimir VLASYUK

IPC: G01R31/28 ,  G01R1/07

CPC classification number: G01R31/2834 ,  G01R1/071 ,  G01R31/2863

Abstract: The disclosure is directed to a device interface, system and method for connecting a Tester Interface Unit (TIU) to an automated test equipment that enable data rates of over 1.0 Gbps over scalable high speed cables. The device interface includes at least one flange assembly connecting an electron beam probe (EBP) in a vacuum-controlled environment to an ambient environment, the flange assembly including a vacuum-controlled passthrough environment coupled to the EBP, a plurality of cables coupled to a plurality of connectors within the vacuum-controlled passthrough environment to provide power, control and signal connections to the ambient environment, the plurality cables including plurality of hermetically-sealed printed circuit boards (PCBs) carrying digital high speed signals from the TIU, a plurality of power cables supporting a plurality of power requirements, and a plurality of ATE communication control cables to direct the TIU.

公开(公告)号：US20200300912A1

公开(公告)日：2020-09-24

申请号：US16361816

申请日：2019-03-22

Applicant: INTEL CORPORATION

Inventor： Jesse ARMAGOST ,  Nathan BLACKWELL ,  Matthew BOELTER ,  Geoffrey KELLY ,  James NEEB ,  Sundar PATHY ,  Yu ZHANG ,  Shelby ROLLINS

IPC: G01R31/317 ,  G01R31/319

Abstract: Embodiments described herein may be directed to receiving a plurality of data captured, respectively, by a plurality of test instruments coupled to a device under test, wherein a plurality of data elements within, respectively, the plurality of captured data are associated with a timestamp based upon a time a data element was captured. Embodiments may also analyze the received plurality of data captured, respectively, by the one or more test instruments, and graphically display at least a portion of the analyzed plurality of captured data to a user. Other embodiments may be identified herein.