公开(公告)号：US10692757B2

公开(公告)日：2020-06-23

申请号：US15568791

申请日：2015-05-28

Applicant: Intel Corporation

Inventor： Marie Krysak ,  Robert Lindsey Bristol ,  Paul Anton Nyhus ,  Michael J. Leeson

IPC: G03F7/004 ,  H01L21/768 ,  H01L21/311 ,  H01L21/027 ,  G03F7/20 ,  G03F7/038 ,  G03F7/039 ,  G03F7/095 ,  C08F212/32 ,  C08F212/14 ,  G03F7/32 ,  G03F7/38 ,  H01L23/498

Abstract: Embodiments of the invention include photoresist materials and methods of patterning photoresist materials. In an embodiment a photoresist material comprises a plurality of molecular glasses (MGs). In an embodiment, a glass transition temperature Tg of the photoresist material is less than an activation temperature needed to deblock blocking groups from the MGs. Embodiments include a method of patterning a photoresist material that comprises exposing the photoresist material with ultraviolet radiation. The method may also comprise, performing a first post exposure bake at a first temperature, that is less than the activation temperature needed to deblock blocking groups from the MGs, and performing a second post exposure bake at a second temperature that is approximately equal to or greater than the activation temperature needed to deblock blocking groups from the MGs.

公开(公告)号：US10269622B2

公开(公告)日：2019-04-23

申请号：US15529479

申请日：2014-12-24

Applicant: INTEL CORPORATION

Inventor： Rami Hourani ,  Michael J. Leeson ,  Todd R. Younkin ,  Eungnak Han ,  Robert L. Bristol

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532 ,  G03F7/00 ,  G03F7/16 ,  H01L21/027

Abstract: Embodiments of the invention include microelectronic devices and methods of forming such devices. In an embodiment, a microelectronic device, includes one or more pre-patterned features formed into a interconnect layer, with a conformal barrier layer formed over the first wall, and the second wall of one or more of the pre-patterned features. A photoresist layer may formed over the barrier layer and within one or more of the pre-patterned features and a conductive via may be formed in at least one of the pre-patterned features.