公开(公告)号：US20160187906A1

公开(公告)日：2016-06-30

申请号：US14582985

申请日：2014-12-24

Applicant: INTEL CORPORATION

Inventor： Devadatta V. Bodas ,  Muralidhar Rajappa ,  Justin J. Song ,  Andy Hoffman ,  Michael K. Patterson

IPC: G05F1/66 ,  G05B15/02

CPC classification number: G05F1/66 ,  G05B15/02 ,  G06F1/3203 ,  G06F1/329

Abstract: A system and method for computing at a facility having systems of multiple compute nodes to execute jobs of computing. Power consumption of the facility is managed to within a power band. The power consumption may be adjusted by implementing (e.g., by a power balloon) activities having little or no computational output.

Abstract translation: 一种用于在具有多个计算节点的系统的设施上进行计算以执行计算的作业的系统和方法。 设备的功耗被控制在功率范围内。 可以通过实施具有很少或没有计算输出的（例如，通过动力气球）活动来调节功率消耗。

公开(公告)号：US10295283B2

公开(公告)日：2019-05-21

申请号：US14974801

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Michael K. Patterson ,  Andrew C. Alduino

IPC: F28F27/00 ,  F28D20/02 ,  H01L23/34 ,  H01L23/427 ,  G02B6/00 ,  G02B6/42 ,  F28D21/00

Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.

公开(公告)号：US09939834B2

公开(公告)日：2018-04-10

申请号：US14582985

申请日：2014-12-24

Applicant: Intel Corporation

Inventor： Devadatta V. Bodas ,  Muralidhar Rajappa ,  Justin J. Song ,  Andy Hoffman ,  Michael K. Patterson

IPC: G05F1/66 ,  G05B15/02 ,  G06F1/32 ,  G06F9/46

CPC classification number: G05F1/66 ,  G05B15/02 ,  G06F1/3203 ,  G06F1/329

Abstract: A system and method for computing at a facility having systems of multiple compute nodes to execute jobs of computing. Power consumption of the facility is managed to within a power band. The power consumption may be adjusted by implementing (e.g., by a power balloon) activities having little or no computational output.

公开(公告)号：US20170176118A1

公开(公告)日：2017-06-22

申请号：US14974801

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Michael K. Patterson ,  Andrew C. Alduino

IPC: F28F27/00

CPC classification number: F28F27/00 ,  F28D20/02 ,  F28D2021/0029 ,  G02B6/00 ,  G02B6/4268 ,  H01L23/34 ,  H01L23/427 ,  H01L23/4275 ,  Y02E60/145

Abstract: Generally discussed herein are devices and methods for thermal management of a component. An apparatus can include a phase change material substantially at a phase transition temperature of the phase change material, a component near, on, or at least partially in the phase change material, and a heat removal device to transfer heat energy away from the phase change material and maintain the phase change material substantially at the phase transition temperature.