公开(公告)号：US10030916B2

公开(公告)日：2018-07-24

申请号：US14446123

申请日：2014-07-29

Applicant: INTEL CORPORATION

Inventor： Phi Hung Thanh ,  Paul J. Diglio ,  John C. Johnson ,  Jarett L. Rinaldi ,  Arnab Choudhury

IPC: F28F7/00 ,  F28F1/10 ,  F28F3/12 ,  F28F13/06 ,  H01L23/473

Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.