公开(公告)号：US20150194724A1

公开(公告)日：2015-07-09

申请号：US14124207

申请日：2013-08-16

Applicant: INTEL CORPORATION

Inventor： Ana Yepes ,  Helen Kankan Pan ,  Mohamed A. Megahed ,  Bryce Horine ,  Eran Gerson ,  Raana Sover

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01Q1/241 ,  H01Q1/2291 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/065

Abstract: Embodiments of millimeter-wave antenna structures are generally described herein. The antenna structure may include an a radiating-element layer comprising a patterned conductive material, a ground layer comprising conductive material disposed on a dielectric substrate, and a feed-line layer comprising conductive material disposed on a dielectric substrate. In some embodiments, the antenna structure may include an air-gap layer disposed between the radiating-element layer and the ground layer. The air-gap layer may include spacing elements to separate the radiating-element layer and the ground layer by a predetermined distance. In some other embodiments, the radiating-element layer may be disposed on a radiating-element dielectric substrate which may include one or more cavities between the radiating-element layer and the ground layer.

Abstract translation: 这里通常描述毫米波天线结构的实施例。 天线结构可以包括包括图案化导电材料的辐射元件层，包括设置在电介质基底上的导电材料的接地层，以及包括设置在电介质基底上的导电材料的馈电线层。 在一些实施例中，天线结构可以包括设置在辐射元件层和接地层之间的气隙层。 气隙层可以包括用于将辐射元件层和接地层分开预定距离的间隔元件。 在一些其他实施例中，辐射元件层可以设置在辐射元件电介质基底上，辐射元件电介质基底可包括辐射元件层和接地层之间的一个或多个腔。