公开(公告)号：US20150318655A1

公开(公告)日：2015-11-05

申请号：US14751871

申请日：2015-06-26

Applicant: INTEL CORPORATION

Inventor： GREGORIO R. MURTAGIAN ,  BHANU JAISWAL ,  SRIRAM SRINIVASAN ,  MICHAEL J. HILL

IPC: H01R43/20

CPC classification number: H01R43/205 ,  H01R12/73 ,  H01R13/6205 ,  H01R43/26 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149

Abstract: A mechanism is described for facilitating and employing a magnetic grid array according to one embodiment. A method of embodiments may include engaging, via magnetic force of a magnet, magnetic contacts of a magnetic grid array to substrate lands of a package substrate of an integrated circuit package of a computing system, and disengaging, via a removal lever, the magnetic contacts from the substrate lands.

Abstract translation: 描述了根据一个实施例的用于促进和采用磁栅阵列的机构。 实施例的方法可以包括通过磁体的磁力使磁栅阵列的磁触点与计算系统的集成电路封装的封装衬底的衬底焊盘接合，并且经由去除杆将磁触头 从衬底。