公开(公告)号：US10686482B2

公开(公告)日：2020-06-16

申请号：US15386753

申请日：2016-12-21

Applicant: Intel Corporation

Inventor： Yaniv Michaeli ,  Menashe Soffer ,  Omer Asaf ,  Ana M. Yepes ,  Manish A. Hiranandani ,  Anand S. Konanur

IPC: H04B1/3888 ,  H04M1/02 ,  H01Q21/06 ,  H01Q13/10 ,  H01Q1/24 ,  H01Q1/42 ,  H04W88/02 ,  H04W88/08

Abstract: A metal chassis for a mobile device is configured to transmit a signal of a wavelength. A first side of the chassis faces the inside of the mobile device and includes a first aperture that has a dimension that comprises a first subwavelength width of a slot in the chassis. A second side of the chassis faces free space and includes a second aperture that has a dimension that comprises a second subwavelength width of the slot in the chassis. A channel connects the first aperture and the second aperture. The slot has a length dimension and the channel may be centered along the length dimension. The channel is configured to support a transverse electromagnetic mode for propagation of the signal from the first aperture through the channel to the second aperture. As a part of a mobile device the chassis acts as a secondary radiator for the mobile device.

公开(公告)号：US10522898B2

公开(公告)日：2019-12-31

申请号：US15756923

申请日：2016-08-30

Applicant: INTEL CORPORATION

Inventor： Min Keen Tang ,  Ana M. Yepes ,  Yaniv Michaeli ,  Menashe Soffer

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q21/28

Abstract: Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.