公开(公告)号：US09177849B2

公开(公告)日：2015-11-03

申请号：US13719136

申请日：2012-12-18

Applicant: Intermolecular, Inc.

Inventor： Rajesh Kelekar ,  Glen Eric Egami ,  Aaron T. Francis

IPC: H01L21/687 ,  H01L21/683 ,  G03F7/20

CPC classification number: H01L21/6838 ,  G03F7/707 ,  H01L21/68735 ,  H01L21/68757 ,  Y10T279/11

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract translation: 描述了用于在加工期间安装和保持半导体晶片的卡盘，特别适用于涉及将晶片卡盘结构完全浸入液体中的晶片加工。 公开了用于防止或阻碍处理化学品接触和污染正在进行处理的晶片的下侧的大部分的卡盘结构，将这种化学接触限制在晶片周边上容易清洁的相对较小的环形区域。 实施例包括在晶片的下侧上具有补充气体流动的结构，以及产生气体/液体弯月面以防止晶片下侧的化学渗透。 还描述了使用这种卡盘处理半导体晶片的方法。

公开(公告)号：US20140166050A1

公开(公告)日：2014-06-19

申请号：US13719136

申请日：2012-12-18

Applicant: INTERMOLECULAR, INC.

Inventor： Rajesh Kelekar ,  Glen Eric Egami ,  Aaron T. Francis

IPC: H01L21/683

CPC classification number: H01L21/6838 ,  G03F7/707 ,  H01L21/68735 ,  H01L21/68757 ,  Y10T279/11

Abstract: Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Abstract translation: 描述了用于在加工期间安装和保持半导体晶片的卡盘，特别适用于涉及将晶片卡盘结构完全浸入液体中的晶片加工。 公开了用于防止或阻碍处理化学品接触和污染正在进行处理的晶片的下侧的大部分的卡盘结构，将这种化学接触限制在晶片周边上容易清洁的相对较小的环形区域。 实施例包括在晶片的下侧上具有补充气体流动的结构，以及产生气体/液体弯月面以防止晶片下侧的化学渗透。 还描述了使用这种卡盘处理半导体晶片的方法。