公开(公告)号：US20140133265A1

公开(公告)日：2014-05-15

申请号：US13673560

申请日：2012-11-09

Applicant: INTERMOLECULAR, INC.

Inventor： Aaron T. Francis ,  Peter Satitpunwaycha ,  John Schmidt

IPC: B01F13/08

CPC classification number: B01F13/0863

Abstract: Provided are liquid agitating systems having magnetically actuated agitating members that do not come in contact with internal surfaces of liquid holding vessels. As such, some mechanically weak materials, such as polytetrafluoroethylene and perfluoroalkoxy polymer, may be used for internal surfaces of these vessels. An agitating member may be held by a supporting member that allows the agitating member to move within a vessel without touching its bottom. The supporting member effectively controls the distance between the agitating member and some supporting point. An external magnet provided under the vessel may be used for magnetic actuation. The agitating member includes an internal magnet that is magnetically coupled to the external magnet and that follows the path of the external magnet thereby moving the agitating member and agitating the liquid. In some embodiments, multiple external magnets may be used to position one or more agitating member.

Abstract translation: 提供了具有不与液体保持容器的内表面接触的具有磁力驱动的搅拌构件的液体搅拌系统。 因此，可以使用一些机械弱的材料，例如聚四氟乙烯和全氟烷氧基聚合物，用于这些容器的内表面。 搅拌构件可以由允许搅拌构件在容器内移动而不接触其底部的支撑构件保持。 支撑构件有效地控制搅拌构件与一些支撑点之间的距离。 设置在容器下方的外部磁体可用于磁致动。 搅拌构件包括磁耦合到外部磁体并且沿着外部磁体的路径的内部磁体，从而移动搅拌构件并搅拌液体。 在一些实施例中，可以使用多个外部磁体来定位一个或多个搅拌构件。

公开(公告)号：US20140166134A1

公开(公告)日：2014-06-19

申请号：US13715957

申请日：2012-12-14

Applicant: INTERMOLECULAR, INC.

Inventor： Peter Satitpunwaycha

IPC: G05D7/01

CPC classification number: F04B1/00 ,  F04B53/1077 ,  F04F3/00 ,  Y10T137/86002 ,  Y10T137/86115 ,  Y10T137/86139 ,  Y10T137/86163

Abstract: Embodiments provided herein describe pumps and methods for pumping fluids. A first fixed valve has a passageway extending therethrough with first and second ends. The first fixed valve is configured to allow fluid flow through the passageway towards the second end thereof and at least partially restrict fluid flow towards the first end thereof. A pumping structure is in fluid communication with the second end of the passageway of the first fixed valve. A second fixed valve has a passageway extending therethrough with third and fourth ends. The second fixed valve is configured to allow fluid flow through the passageway towards the fourth end thereof and at least partially restrict fluid flow towards the third end thereof. The third end of the passageway of the second fixed valve is in fluid communication with the pumping structure and the second end of the passageway of the first fixed valve.

Abstract translation: 本文提供的实施例描述了用于泵送流体的泵和方法。 第一固定阀具有通过其延伸的第一和第二端的通道。 第一固定阀被构造成允许流体流过通道朝向其第二端，并且至少部分地限制流向其第一端的流体流动。 泵送结构与第一固定阀的通道的第二端流体连通。 第二固定阀具有通过第三和第四端延伸穿过的通道。 第二固定阀构造成允许流体流过通道朝向其第四端，并且至少部分地限制流向其第三端的流体流动。 第二固定阀的通道的第三端与泵送结构和第一固定阀的通道的第二端流体连通。

公开(公告)号：US20140147593A1

公开(公告)日：2014-05-29

申请号：US13686072

申请日：2012-11-27

Applicant: INTERMOLECULAR, INC.

Inventor： Peter Satitpunwaycha

IPC: B05C21/00

CPC classification number: B01J19/0046 ,  B01J2219/0043 ,  B01J2219/00495 ,  B01J2219/00754 ,  B01J2219/00756 ,  C23C14/042 ,  C23C14/352

Abstract: Methods and systems to control the temperature of a substrate during a physical vapor deposition (PVD) process are provided. A temperature controlled apertured shield can be disposed on the surface of the substrate, surrounding the substrate area that is subjected to the deposition process. The temperature controlled apertured shield can be actively cooled, for example, by a circulated coolant, which can absorb heat from the deposition region and maintaining a desired temperature for the deposited films. In some embodiments, the temperature controlled apertured shield can be used in a high productivity combinatorial (HPC) system, allowing screening of materials and process conditions.

Abstract translation: 提供了在物理气相沉积（PVD）工艺期间控制衬底的温度的方法和系统。 温度控制的有孔屏蔽可以设置在衬底的表面上，围绕着经历沉积过程的衬底区域。 温度控制的有孔屏蔽可以例如通过循环的冷却剂而被主动冷却，该循环冷却剂可以吸收来自沉积区域的热量并保持沉积膜的期望温度。 在一些实施例中，温度控制的有孔屏蔽可用于高生产率组合（HPC）系统中，允许筛选材料和工艺条件。