公开(公告)号：US20170131477A1

公开(公告)日：2017-05-11

申请号：US14933705

申请日：2015-11-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Brett CUCCI ,  Paul F. FORTIER ,  Jeffrey P. GAMBINO ,  Robert K. LEIDY ,  Qizhi LIU ,  Richard J. RASSEL

IPC: G02B6/30 ,  G02B6/13

CPC classification number: G02B6/30 ,  G02B6/4243 ,  G02B6/428

Abstract: The disclosure relates to semiconductor structures and, more particularly, to structures for preventing dicing damage on photonics wafers. The structure includes: an optical waveguide structure to optical fiber interface formed on an integrated circuit; and a groove formed in a substrate and which includes a structure preventing a fluid pressure of a dicing operation from damaging the substrate along the groove.