公开(公告)号：US20200267830A1

公开(公告)日：2020-08-20

申请号：US16278814

申请日：2019-02-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  David Long ,  Michael Fisher ,  James Busby ,  John R. Dangler ,  Robert Weiss ,  Zachary Thomas Dreiss ,  Rorie Paul Reyes

IPC: H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.

公开(公告)号：US11026324B2

公开(公告)日：2021-06-01

申请号：US16278814

申请日：2019-02-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  David Long ,  Michael Fisher ,  James Busby ,  John R. Dangler ,  Robert Weiss ,  Zachary Thomas Dreiss ,  Rorie Paul Reyes

IPC: H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.