公开(公告)号：US11882645B2

公开(公告)日：2024-01-23

申请号：US17451827

申请日：2021-10-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Sushumna Iruvanti ,  James Busby ,  Philipp K Buchling Rego ,  Steven Paul Ostrander ,  Thomas Anthony Wassick ,  William Santiago-Fernandez ,  Nihad Hadzic

IPC: H05K1/02 ,  H01L23/00 ,  G06F21/86

CPC classification number: H05K1/0201 ,  G06F21/86 ,  H01L23/57 ,  H05K1/0275

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

公开(公告)号：US11716808B2

公开(公告)日：2023-08-01

申请号：US17117267

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  Arthur J. Higby ,  David J. Lewison ,  Philipp K. Buchling Rego ,  Jay A. Bunt ,  James Busby ,  Levi Campbell

IPC: G08B21/00 ,  H05K1/02 ,  F28F13/00 ,  G08B21/18 ,  H05K7/20

CPC classification number: H05K1/0275 ,  F28F13/003 ,  G08B21/18 ,  H05K7/20445 ,  H05K7/20409 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

公开(公告)号：US20230054606A1

公开(公告)日：2023-02-23

申请号：US17404071

申请日：2021-08-17

Applicant: International Business Machines Corporation

Inventor： Arthur J. Higby ,  DAVID CLIFFORD LONG ,  Edward N. Cohen ,  John R. Dangler ,  Matthew Doyle ,  Philipp K. Buchling Rego ,  William Santiago-Fernandez ,  Levi CAMPBELL ,  James Busby

IPC: H04L9/08 ,  F28D15/02

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

公开(公告)号：US10956623B2

公开(公告)日：2021-03-23

申请号：US16007408

申请日：2018-06-13

Applicant: International Business Machines Corporation

Inventor： Silvio Dragone ,  Michael Fisher ,  William Santiago Fernandez ,  Ryan Elsasser ,  James Busby ,  John R. Dangler ,  William L. Brodsky ,  David C. Long ,  Stefano S. Oggioni

IPC: G06F21/87 ,  H01L41/04 ,  H01L41/047 ,  H01L41/37 ,  H01L41/113 ,  H01L41/18 ,  H01L41/23 ,  H01L41/053

Abstract: The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.

公开(公告)号：US11991277B2

公开(公告)日：2024-05-21

申请号：US17404071

申请日：2021-08-17

Applicant: International Business Machines Corporation

Inventor： Arthur J. Higby ,  David Clifford Long ,  Edward N. Cohen ,  John R. Dangler ,  Matthew Doyle ,  Philipp K. Buchling Rego ,  William Santiago-Fernandez ,  Levi Campbell ,  James Busby

IPC: H04L9/08 ,  F28D15/02

CPC classification number: H04L9/0877 ,  F28D15/0275

Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.

公开(公告)号：US20240098882A1

公开(公告)日：2024-03-21

申请号：US17933693

申请日：2022-09-20

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  DAVID CLIFFORD LONG ,  Matteo Cocchini ,  Russell A. Budd ,  James Busby ,  Roger S. Krabbenhoft ,  Arthur J. Higby

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00

CPC classification number: H05K1/0228 ,  H01P3/081 ,  H01P11/003

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

公开(公告)号：US20220382921A1

公开(公告)日：2022-12-01

申请号：US17335185

申请日：2021-06-01

Applicant: International Business Machines Corporation

Inventor： William Santiago-Fernandez ,  Russell A. Budd ,  James Busby ,  Arthur J Higby ,  MICHAEL FISHER ,  Silvio Dragone ,  Stefano Sergio Oggioni ,  DAVID CLIFFORD LONG

IPC: G06F21/87 ,  H05K1/02

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

公开(公告)号：US11026324B2

公开(公告)日：2021-06-01

申请号：US16278814

申请日：2019-02-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  David Long ,  Michael Fisher ,  James Busby ,  John R. Dangler ,  Robert Weiss ,  Zachary Thomas Dreiss ,  Rorie Paul Reyes

IPC: H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention are directed to a method for creating a secure volume. A method includes adhering a flexible circuit to a surface of an enclosure. A first portion of the flexible circuit extends outward from the perimeter of the enclosure. A second portion of the flexible circuit is adhered to the center portion of the enclosure. Pressure is applied to the flexible circuit to ensure that it is affixed to the enclosure. The flexible circuit and the enclosure are then subjected to an annealing temperature. The duration and temperature are based on the adhesive and flexible circuit material. The extended portion of the flexible circuit is coated with an adhesive and folded over the second portion of the flexible circuit. Pressure is applied to the folded flexible circuit. The folded flexible circuit is then subjected to an annealing temperature.

公开(公告)号：US10595419B1

公开(公告)日：2020-03-17

申请号：US16170005

申请日：2018-10-24

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  James Busby ,  David C. Long ,  Robert Weiss ,  Michael Fisher ,  Tristen Gaudette

IPC: H05K3/32 ,  B29C33/00 ,  B29C33/44 ,  B29C33/12 ,  B29C44/02 ,  B29C44/08 ,  B29C44/12 ,  B29C70/00 ,  B29C70/84 ,  H05K3/46 ,  G06F21/87 ,  H01L23/31 ,  H05K1/02

Abstract: A fixture assembly for deforming a flex circuit that includes: a base plate having a recess; a wrinkle reducer plate having a first cut-out portion aligned with the recess; a stiffening block having a second cut-out portion aligned with the recess and the first cut-out portion; and a punch to slideably engage with the recess, the first cut-out portion and the second cut-out portion; wherein, in operation, a flex circuit is placed between the base plate and wrinkle reducer plate and the punch extends through the first cut-out portion and the second cut-out portion to engage the flex circuit and deform the flex circuit into the recess so that the flex circuit has a formed section in the shape of the recess and a flat section clamped by the wrinkle reducer plate and the base plate.

公开(公告)号：US12005148B2

公开(公告)日：2024-06-11

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing Zhang ,  David J. Lewison ,  Frank L. Pompeo ,  James Busby ,  Jay A. Bunt ,  Joyce E. Molinelli Acocella ,  Madhana Sunder ,  Michael J. Ellsworth, Jr.

IPC: A61L2/10 ,  F21V29/58 ,  H05K7/20

CPC classification number: A61L2/10 ,  F21V29/59 ,  A61L2202/11 ,  A61L2202/14 ,  H05K7/20763

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.